18453026. CHIP PROTECTION DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 CHIP PROTECTION DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP PROTECTION DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CHIP PROTECTION DEVICE
Organization Name
Inventor(s)
Gyuhyeong Kim of Suwon-si (KR)
Seunghwan Kim of Suwon-si (KR)
CHIP PROTECTION DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18453026 titled 'CHIP PROTECTION DEVICE
Simplified Explanation
The chip protection device described in the patent application is designed to protect a semiconductor chip mounted on a substrate by using a protection frame that surrounds the chip's side surfaces. The protection frame includes side walls and upper walls, with apertures for fluid flow to dissipate heat from the chip.
- The protection frame surrounds the side surfaces of a semiconductor chip to provide physical protection.
- The frame includes side walls and upper walls to create an inner space for fluid flow.
- Apertures in the side walls allow fluid to enter and exit the inner space.
- Heat from the chip's side surfaces is transferred to the fluid in the inner space for cooling.
Potential Applications
The technology could be applied in:
- Electronic devices
- Computer systems
- Automotive systems
Problems Solved
- Overheating of semiconductor chips
- Physical damage to chips during handling or operation
Benefits
- Improved chip longevity
- Enhanced performance due to better heat dissipation
Potential Commercial Applications
- Semiconductor manufacturing companies
- Electronics manufacturers
- Automotive industry suppliers
Possible Prior Art
One possible prior art could be the use of heat sinks or fans for cooling semiconductor chips.
Unanswered Questions
How does the fluid flow through the apertures in the protection frame?
The patent application does not provide detailed information on the mechanism of fluid flow within the protection frame.
What types of fluids can be used in the inner space for cooling?
The patent application does not specify the types of fluids that can be used for cooling the semiconductor chip.
Original Abstract Submitted
A chip protection device includes a protection frame extending around side surfaces of a semiconductor chip mounted on a substrate. The protection frame includes a plurality of side walls, each wall facing and spaced apart from a respective side surface of the semiconductor chip, and a plurality of upper walls, each upper wall extending inward from an upper portion of a respective side wall toward the semiconductor chip. A plurality of apertures are formed through the side walls and through which a fluid enters and exits. The protection frame defines an inner space in which the fluid can flow via the plurality of apertures. Heat from the side surfaces of the semiconductor chip is transferred to the fluid in the inner space.
