18451799. APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
Contents
- 1 APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18451799 titled 'APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation
The apparatus for manufacturing semiconductor devices includes a pickup apparatus with a stage and a suction unit to vacuum-suck a space between components.
- The pickup apparatus includes a stage with protruding portions facing the back surface of a dicing sheet and a suction unit to vacuum-suck the space between components.
- The protruding portions on the stage consist of first and second protruding portions that differ in height or vertical elastic modulus from each other.
Potential Applications
This technology can be applied in semiconductor manufacturing processes, specifically in the handling and assembly of semiconductor chips.
Problems Solved
This technology solves the problem of efficiently and accurately picking up and handling semiconductor chips during the manufacturing process.
Benefits
The benefits of this technology include improved precision in handling semiconductor chips, increased efficiency in manufacturing processes, and potentially reduced risk of damage to the chips.
Potential Commercial Applications
The potential commercial applications of this technology include semiconductor manufacturing companies looking to enhance their production processes with improved handling and assembly capabilities.
Possible Prior Art
One possible prior art for this technology could be existing semiconductor handling equipment with similar functionalities but without the specific design features of the protruding portions on the stage.
What are the specific design features of the protruding portions on the stage?
The specific design features of the protruding portions on the stage include a combination of first and second protruding portions that differ in height or vertical elastic modulus from each other, allowing for more precise and efficient handling of semiconductor chips.
How does the suction unit work in conjunction with the protruding portions on the stage to pick up semiconductor chips?
The suction unit vacuum-sucks the space between the components, including the outer frame, dicing sheet, and stage, while the protruding portions on the stage help position and stabilize the semiconductor chip for pickup and handling.
Original Abstract Submitted
An apparatus for manufacturing semiconductor device includes a pickup apparatus. The pickup apparatus includes: a stage including a plurality of protruding portions disposed so as to face a back surface of a dicing sheet to which a semiconductor chip is attached; and a suction unit configured to vacuum-suck a space between an outer frame, the dicing sheet, and the stage. The plurality of protruding portions includes a plurality of first protruding portions and a plurality of second protruding portions different in height or vertical elastic modulus from each other.
