18450457. DETERMINING APPARATUS, PATTERN FORMING APPARATUS, AND METHOD FOR MANUFACTURING ARTICLE simplified abstract (CANON KABUSHIKI KAISHA)

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DETERMINING APPARATUS, PATTERN FORMING APPARATUS, AND METHOD FOR MANUFACTURING ARTICLE

Organization Name

CANON KABUSHIKI KAISHA

Inventor(s)

TAKAHIRO Yamamoto of Tochigi (JP)

MITSURU Inose of Ibaraki (JP)

DETERMINING APPARATUS, PATTERN FORMING APPARATUS, AND METHOD FOR MANUFACTURING ARTICLE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18450457 titled 'DETERMINING APPARATUS, PATTERN FORMING APPARATUS, AND METHOD FOR MANUFACTURING ARTICLE

Simplified Explanation

The determining apparatus described in the patent application is designed to assess the presence of foreign substances on substrate stages without compromising productivity. It achieves this by analyzing the surface condition of substrates on two different stages.

  • The determining apparatus evaluates the surface state of substrates on the first and second substrate stages using detection results.
  • By comparing the detection results, the apparatus can identify any foreign substances present on the substrate surfaces.
  • This technology helps in maintaining productivity by quickly detecting and addressing any contamination on the substrate stages.

Potential Applications

- Semiconductor manufacturing - Quality control in production processes - Surface inspection in industrial settings

Problems Solved

- Efficient detection of foreign substances on substrate stages - Preventing productivity loss due to contamination - Ensuring high-quality output in manufacturing processes

Benefits

- Improved quality control - Enhanced productivity - Early detection of issues for timely resolution


Original Abstract Submitted

In order to provide a determining apparatus capable of determining whether there is a foreign substance on a substrate stage with suppressing a decrease in productivity of an apparatus, the determining apparatus according to the present invention is configured to determine a state of a surface of each of a first substrate stage and a second substrate stage based on a first detection result of a substrate surface of a substrate mounted on the first substrate stage and a second detection result of the substrate surface of the substrate mounted on the second substrate stage.