18449452. SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE simplified abstract (Western Digital Technologies, Inc.)
Contents
SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE
Organization Name
Western Digital Technologies, Inc.
Inventor(s)
SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18449452 titled 'SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE
Simplified Explanation: This patent application focuses on increasing the production yield of integrated circuits with low-k dielectrics by introducing a flip-chip assembly method that addresses chip-integrity issues during assembly operations.
- The semiconductor chip in the assembly has a thickness profile that is thinner near the corners and thicker in the middle portions to alleviate stresses during solder reflow and chip pick-up operations.
- The design reduces the instances of low-k dielectrics cracking during assembly, thus improving manufacturing yield.
Key Features and Innovation:
- Flip-chip assembly method for integrated circuits with low-k dielectrics.
- Semiconductor chip with varying thickness profile to address chip-integrity issues.
- Reduction in instances of low-k dielectrics cracking during assembly operations.
Potential Applications: This technology can be applied in the semiconductor industry for the production of integrated circuits with low-k dielectrics.
Problems Solved:
- Chip-integrity issues during solder reflow and chip pick-up operations.
- Cracking of low-k dielectrics during assembly.
Benefits:
- Increased manufacturing yield of integrated circuits.
- Improved reliability of integrated circuits with low-k dielectrics.
Commercial Applications: Potential commercial applications include semiconductor manufacturing companies looking to enhance the production yield of integrated circuits with low-k dielectrics.
Questions about Flip-Chip Assembly Technology: 1. How does the thickness profile of the semiconductor chip help alleviate chip-integrity issues? 2. What are the specific benefits of reducing instances of low-k dielectrics cracking during assembly operations?
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Original Abstract Submitted
Approaches directed at increasing the production yield of integrated circuits including layers of low-k dielectrics. One example provides a flip-chip assembly including a semiconductor chip attached to a substrate using pillars or bumps. The semiconductor chip has a thickness profile such that the chip is thinner near the corners than in middle portions. The thinner corner portions beneficially alleviate chip-integrity issues related to the stresses generated during the solder reflow operation while the thicker middle portions beneficially alleviate chip-integrity issues related to the stresses generated during the chip or die pick-up operation. Due to the alleviation of both types of chip-integrity issues, the number of instances in which the low-k dielectrics crack during the corresponding assembly operations is significantly reduced, thereby beneficially increasing the manufacturing yield.
