18444982. ELECTRONIC COMPONENT MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
Contents
ELECTRONIC COMPONENT MODULE
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
ELECTRONIC COMPONENT MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18444982 titled 'ELECTRONIC COMPONENT MODULE
Simplified Explanation: The patent application describes an electronic component module with components mounted on both surfaces of a circuit board.
- The electronic component module includes a circuit board with a first main surface and a second main surface.
- A first electronic component is mounted on the first main surface, and a second electronic component is mounted on the second main surface.
- There is an electrode for input/output on the first main surface, connected to a columnar electrode.
- A sealing resin layer covers the first main surface, and an insulating layer covers the first electronic component and the sealing resin layer.
- An input/output electrode is present on the insulating layer, connected to the columnar electrode through a conductor.
Key Features and Innovation:
- Components mounted on both surfaces of a circuit board.
- Use of sealing resin and insulating layers for protection.
- Columnar electrode design for input/output connections.
Potential Applications: This technology could be used in various electronic devices such as smartphones, tablets, and IoT devices.
Problems Solved: This technology addresses the challenge of efficiently mounting components on both sides of a circuit board while ensuring proper connectivity.
Benefits:
- Compact design
- Enhanced protection for components
- Efficient input/output connections
Commercial Applications: The technology can be applied in the consumer electronics industry for the development of compact and efficient electronic devices.
Prior Art: Readers can explore prior patents related to electronic component modules and circuit board designs for further insights into this technology.
Frequently Updated Research: Stay updated on advancements in electronic component mounting techniques and circuit board design for potential improvements in this technology.
Questions about Electronic Component Module with Components Mounted on Both Surfaces of a Board: 1. What are the key advantages of mounting components on both surfaces of a circuit board? 2. How does the columnar electrode design improve input/output connections in this technology?
Original Abstract Submitted
An electronic component module with components mounted on both surfaces of a board, the electronic component module including: a circuit board including a first main surface and a second main surface; a first electronic component mounted on the first main surface; a second electronic component mounted on the second main surface; an electrode for input/output on the first main surface; a columnar electrode connected to the electrode for input/output; a sealing resin layer covering the first main surface; an insulating layer covering the first electronic component and the sealing resin layer; an input/output electrode on the insulating layer; and a conductor, wherein the columnar electrode includes an end surface exposed from the sealing resin layer, and the input/output electrode is connected to the columnar electrode through the conductor.
