18444742. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Sen-Kuei Hsu of Kaohsiung City (TW)
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18444742 titled 'PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
The package structure described in the patent application consists of a first redistribution circuit structure, a second redistribution circuit structure, a semiconductor die, a waveguide structure, and an antenna. The semiconductor die is positioned between and connected to the first and second redistribution circuit structures. The waveguide structure is located adjacent to the semiconductor die and is electrically connected to it, with parts of the redistribution circuit structures and multiple vias linking them. The antenna is situated on the semiconductor die, with the second redistribution circuit structure between the antenna and the die, and the antenna communicates electrically with the semiconductor die through the waveguide structure.
- The package structure includes a semiconductor die sandwiched between and electrically coupled to two redistribution circuit structures.
- A waveguide structure is positioned beside the semiconductor die and is electrically connected to it, incorporating parts of the redistribution circuit structures and multiple vias.
- An antenna is located on the semiconductor die, with the second redistribution circuit structure between the antenna and the die, enabling electrical communication through the waveguide structure.
Potential Applications: - This technology could be utilized in wireless communication systems. - It may find applications in radar systems and satellite communication.
Problems Solved: - Improved signal transmission and reception capabilities. - Enhanced integration of components in a compact package.
Benefits: - Increased efficiency in signal processing. - Reduction in size and weight of communication systems. - Enhanced performance and reliability.
Commercial Applications: Title: Advanced Wireless Communication Package Structure for Enhanced Signal Processing This technology could be commercialized for use in 5G communication systems, satellite communication equipment, and radar systems, offering improved signal processing capabilities and compact design for various industries.
Prior Art: Readers can explore prior patents related to waveguide structures, antenna integration on semiconductor dies, and compact package designs for communication systems to gain more insights into the existing technology landscape.
Frequently Updated Research: Researchers are continuously exploring advancements in waveguide technology, antenna design, and semiconductor integration for enhanced signal processing and communication systems. Stay updated on the latest developments in these areas for potential improvements in package structures.
Questions about the technology: 1. How does the integration of the waveguide structure enhance signal processing in the package structure? 2. What are the potential challenges in implementing this technology in commercial communication systems?
Original Abstract Submitted
A package structure includes a first redistribution circuit structure, a second redistribution circuit structure, a semiconductor die, a waveguide structure, and an antenna. The semiconductor die is sandwiched between and electrically coupled to the first redistribution circuit structure and the second redistribution circuit structure. The waveguide structure is located aside and electrically coupled to the semiconductor die, wherein the waveguide structure includes a part of the first redistribution circuit structure, a part of the second redistribution circuit structure and a plurality of first through vias each connecting to the part of the first redistribution circuit structure and the part of the second redistribution circuit structure. The antenna is located on the semiconductor die, wherein the second redistribution circuit structure is sandwiched between the antenna and the semiconductor die, and the antenna is electrically communicated with the semiconductor die through the waveguide structure.
