18444114. Device With Molded Polymer Structures simplified abstract (Apple Inc.)
Contents
Device With Molded Polymer Structures
Organization Name
Inventor(s)
Christopher Patton of San Jose CA (US)
Michael J. Oudenhoven of San Francisco CA (US)
Suresh C. Gopalan of San Jose CA (US)
Device With Molded Polymer Structures - A simplified explanation of the abstract
This abstract first appeared for US patent application 18444114 titled 'Device With Molded Polymer Structures
The abstract describes a patent application for a head-mounted device with a metal frame member that provides structural support and houses circuitry such as strain gauge circuitry and cabling. A protective polymer like thermoset epoxy encapsulates and protects the circuitry, allowing for injection molding operations without exposing the circuitry to elevated temperatures.
- Metal frame member provides structural support for the head-mounted device
- Circuitry such as strain gauge circuitry and cabling is coupled to the metal frame member
- Protective polymer like thermoset epoxy encapsulates and protects the circuitry
- Injection molding is used to apply thermoplastic polymer to the metal frame member to form the head-mounted frame
Potential Applications: - Augmented reality devices - Virtual reality headsets - Medical devices for monitoring head movements
Problems Solved: - Protecting circuitry from damage during manufacturing processes - Providing structural support for head-mounted devices
Benefits: - Enhanced durability of head-mounted devices - Improved functionality and reliability of circuitry - Simplified manufacturing processes
Commercial Applications: Title: "Enhancing Durability and Functionality of Head-Mounted Devices" This technology can be used in the development of consumer-grade augmented reality headsets, medical devices for monitoring head movements, and industrial applications for hands-free operation.
Prior Art: Prior art related to this technology may include patents or research on protective coatings for electronic components in wearable devices, injection molding processes for electronic devices, and strain gauge technology in head-mounted devices.
Frequently Updated Research: Researchers may be exploring new materials for protective coatings, advancements in strain gauge technology, and innovative manufacturing processes for head-mounted devices.
Questions about Head-Mounted Devices: 1. How does the protective polymer enhance the durability of the head-mounted device? 2. What are the key advantages of using a metal frame member for structural support in head-mounted devices?
Original Abstract Submitted
A head-mounted device may have a head-mounted frame with lens openings. The head-mounted device may have left and right lenses mounted in the lens openings. The lenses may include waveguides that help guide images from projectors to eye boxes for viewing by a user. The frame may include a metal frame member that supplies the frame with structural support. Circuitry such as strain gauge circuitry and cabling may be coupled to the metal frame member. A protective polymer such as thermoset epoxy may be used to encapsulate and protect the circuitry. The protective polymer may encapsulate the strain gauge, the cabling, and/or other circuitry so that this circuitry need not be exposed to elevated temperatures during subsequent injection molding operations. Injection molding may be used to apply one or more shots of thermoplastic polymer to the metal frame member to form the head-mounted frame.
