18443481. DUAL-PUMP COOLING CIRCUIT simplified abstract (Oshkosh Corporation)
Contents
DUAL-PUMP COOLING CIRCUIT
Organization Name
Inventor(s)
Chris Goodman of Oshkosh WI (US)
Christopher Rukas of Oshkosh WI (US)
DUAL-PUMP COOLING CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18443481 titled 'DUAL-PUMP COOLING CIRCUIT
Simplified Explanation:
The patent application describes a cooling system that includes pumps to supply coolant to electrical components and a radiator to remove thermal energy from the coolant.
Key Features and Innovation:
- Two coolant pumps supply coolant to electrical components.
- First pump supplies coolant to the first electrical component.
- Second pump supplies coolant to both the first pump and the second electrical component.
- Radiator removes thermal energy from the coolant.
Potential Applications: The technology can be applied in various electronic devices and systems that require efficient cooling mechanisms, such as computers, servers, and automotive electronics.
Problems Solved: The technology addresses the issue of overheating in electrical components, which can lead to performance degradation and potential damage.
Benefits:
- Improved cooling efficiency for electrical components.
- Enhanced performance and longevity of electronic devices.
- Reduced risk of overheating-related malfunctions.
Commercial Applications: The technology can be utilized in the manufacturing of electronic devices, data centers, and automotive systems to ensure optimal performance and reliability.
Prior Art: Readers can explore prior patents related to cooling systems for electronic components, coolant pump technologies, and radiator designs to gain a deeper understanding of the existing technology landscape.
Frequently Updated Research: Stay informed about the latest advancements in cooling technologies, materials science, and thermal management strategies to enhance the efficiency and effectiveness of cooling systems for electronic devices.
Questions about Cooling Systems: 1. How does the efficiency of the cooling system impact the overall performance of electronic devices? 2. What are the key factors to consider when designing a cooling system for high-performance computing applications?
Original Abstract Submitted
A cooling system includes a first electrical component, a second electrical component, a first coolant pump fluidly coupled to the first electrical component, and a second coolant pump fluidly coupled to an inlet of the first coolant pump and the second electrical component. The first coolant pump is configured to supply a first portion of coolant to the first electrical component. The second coolant pump is configured to supply the first portion of the coolant to the first coolant pump and a second portion of the coolant to the second electrical component. A radiator is fluidly coupled downstream of the first electrical component and the second electrical component and configured to remove thermal energy from the coolant.
