18443338. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Meng-Liang Lin of Hsinchu (TW)
Po-Yao Chuang of Hsin-Chu (TW)
Shuo-Mao Chen of New Taipei City (TW)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18443338 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
The semiconductor package described in the patent application includes a circuit substrate, a semiconductor die, and a filling material. The circuit substrate has a cavity concave from the first surface, with a metal floor plate embedded in the dielectric material below the cavity. The semiconductor die is placed in the cavity and connected to the circuit substrate, with the filling material filling the cavity and encapsulating the semiconductor die.
- The circuit substrate features a metal floor plate that is electrically floating and isolated by dielectric material.
- The semiconductor die is securely attached to the circuit substrate with the filling material.
- The filling material not only fills the cavity but also encapsulates the semiconductor die for protection.
- The design of the semiconductor package ensures electrical connectivity and physical protection of the semiconductor die.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, industrial equipment, and medical devices.
Problems Solved: - Provides a secure and reliable connection between the semiconductor die and the circuit substrate. - Ensures the protection and longevity of the semiconductor die in electronic devices.
Benefits: - Improved reliability and performance of electronic devices. - Enhanced protection for semiconductor components. - Cost-effective manufacturing process for semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be utilized in the consumer electronics industry, automotive sector, and medical device manufacturing. It offers a competitive advantage in terms of reliability and performance for electronic devices.
Prior Art: Prior art related to this technology may include research on semiconductor packaging methods, dielectric materials, and semiconductor device encapsulation techniques.
Frequently Updated Research: Researchers are constantly exploring new materials and methods to improve semiconductor packaging technology. Stay updated on the latest advancements in the field to enhance device performance and reliability.
Questions about Semiconductor Packaging Technology: 1. How does the metal floor plate contribute to the electrical performance of the semiconductor package? 2. What are the key advantages of using filling material to encapsulate the semiconductor die in the package?
Original Abstract Submitted
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. The circuit substrate has a first surface, a second surface opposite to the first surface and a cavity concave from the first surface. The circuit substrate includes a dielectric material and a metal floor plate embedded in the dielectric material and located below the cavity. A location of the metal floor plate corresponds to a location of the cavity. The metal floor plate is electrically floating and isolated by the dielectric material. The semiconductor die is disposed in the cavity and electrically connected with the circuit substrate. The filling material is disposed between the semiconductor die and the circuit substrate. The filling material fills the cavity and encapsulates the semiconductor die to attach the semiconductor die and the circuit substrate.
