18442199. ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
Contents
ELECTRONIC DEVICE
Organization Name
Inventor(s)
Kuan-Feng Lee of Miao-Li County (TW)
Yuan-Lin Wu of Miao-Li County (TW)
ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18442199 titled 'ELECTRONIC DEVICE
The abstract describes an electronic device with an insulating layer, first and second conductive portions, a connective portion, a processing unit, and an electronic element. The conductive portions are on opposite sides of the insulating layer, connected through the connective portion. The processing unit and electronic element are also on opposite sides of the insulating layer, overlapping with the connective portion.
- The electronic device includes an insulating layer, first and second conductive portions, a connective portion, a processing unit, and an electronic element.
- The first and second conductive portions are on opposite sides of the insulating layer, connected through the connective portion.
- The processing unit and electronic element are on opposite sides of the insulating layer, overlapping with the connective portion.
- The processing unit is thicker than the first conductive portion.
- The connective portion is at least partially disposed in the insulating layer.
Potential Applications: - This technology could be used in the development of advanced electronic devices. - It may find applications in the manufacturing of compact and efficient electronic components.
Problems Solved: - Enables the creation of electronic devices with improved connectivity and functionality. - Facilitates the integration of electronic elements in a compact space.
Benefits: - Enhanced performance and connectivity in electronic devices. - Allows for the creation of more compact and efficient electronic components.
Commercial Applications: Title: Advanced Electronic Device Technology for Improved Connectivity This technology could have commercial applications in the consumer electronics industry, particularly in the development of smartphones, tablets, and other portable devices. It could also be utilized in the automotive sector for the production of advanced vehicle electronics.
Questions about Electronic Device Technology: 1. How does the thickness of the processing unit impact the overall performance of the electronic device? The thickness of the processing unit affects the processing power and efficiency of the device, as it determines the space available for components and circuitry.
2. What are the potential challenges in manufacturing electronic devices with such integrated components? Manufacturing challenges may include ensuring precise alignment of the various components, managing heat dissipation, and maintaining electrical connectivity throughout the device.
Original Abstract Submitted
An electronic device includes an insulating layer, a first conductive portion, a second conductive portion, a connective portion, a processing unit and an electronic element. The first conductive portion and the second conductive portion are respectively corresponding to opposite sides of the insulating layer. The connective portion is at least partially disposed in the insulating layer. The first conductive portion is electrically connected to the second conductive portion through the connective portion. The processing unit and the electronic element are respectively corresponding to opposite sides of the insulating layer. The processing unit and the electronic element are overlapped with the connective portion. The thickness of the processing unit is greater than the thickness of the first conductive portion.
