18441462. INTEGRATED CIRCUITS WITH SELECTABLE PACKAGING TYPES simplified abstract (Micron Technology, Inc.)
Contents
INTEGRATED CIRCUITS WITH SELECTABLE PACKAGING TYPES
Organization Name
Inventor(s)
Kishan Chanumolu of Bengaluru (IN)
Sandeep Dwivedi of Bengaluru (IN)
INTEGRATED CIRCUITS WITH SELECTABLE PACKAGING TYPES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18441462 titled 'INTEGRATED CIRCUITS WITH SELECTABLE PACKAGING TYPES
The apparatus described in the patent application includes a die with three faces, I/O cells, wirebonded interconnections, flip-chip interconnections, and a bond area with decoupling capacitors.
- The die has a first face, a second face opposite the first face, and a third face located between them.
- I/O cells are coupled to the first face of the die and can be selectively bonded to a package using wirebonded interconnections at a first pitch or flip-chip interconnections at a larger second pitch.
- A bond area, located between each I/O cell and the third face of the die, includes decoupling capacitors.
Potential Applications: - Semiconductor packaging - Integrated circuit design - Electronic device manufacturing
Problems Solved: - Efficient bonding of I/O cells to packages - Improved signal integrity and power distribution in electronic devices
Benefits: - Enhanced performance of electronic devices - Increased reliability of semiconductor packages - Simplified manufacturing processes
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be used in the production of high-performance electronic devices such as smartphones, computers, and automotive electronics. It can also benefit companies involved in semiconductor packaging and integrated circuit design.
Questions about the technology: 1. How does the use of decoupling capacitors in the bond area improve the performance of electronic devices? 2. What are the advantages of using flip-chip interconnections over wirebonded interconnections in semiconductor packaging?
Original Abstract Submitted
An apparatus includes a die with a first face, a second face opposite the first face, and a third face located between the first face and the second face, I/O cells coupled to the first face of a die, where the I/O cells are configured to be selectively bonded to a package by wirebonded interconnections at a first pitch or flip-chip interconnections at a second pitch that is larger than the first pitch, and a bond area including decoupling capacitors that is located between each I/O cell and the third face of the die.
