18440193. Etched Coupling Structures for Bonded Photonic Dies simplified abstract (Apple Inc.)
Contents
Etched Coupling Structures for Bonded Photonic Dies
Organization Name
Inventor(s)
Jeremy D. Witmer of San Jose CA (US)
Jeffrey T. Hill of Los Altos CA (US)
Zhechao Wang of San Jose CA (US)
Etched Coupling Structures for Bonded Photonic Dies - A simplified explanation of the abstract
This abstract first appeared for US patent application 18440193 titled 'Etched Coupling Structures for Bonded Photonic Dies
Simplified Explanation: The patent application describes an integrated photonic system that aligns multiple photonic dies using contact between pairs of vertical surfaces.
- The system includes multiple photonic dies that are laterally aligned using contact between pairs of vertical surfaces.
- The vertical surfaces are manufactured by defining their shape via processes like photolithography.
- Once the vertical surfaces are aligned and engaged, the multiple photonic dies are optically and mechanically intercoupled.
Key Features and Innovation:
- Integration of multiple photonic dies in a system.
- Lateral alignment of photonic dies using contact between vertical surfaces.
- Manufacturing of vertical surfaces through defined shapes using photolithography.
- Optical and mechanical intercoupling of multiple photonic dies.
Potential Applications:
- Optical communication systems.
- Photonic integrated circuits.
- Sensing and imaging devices.
Problems Solved:
- Simplified alignment of multiple photonic dies.
- Enhanced optical and mechanical intercoupling.
- Improved manufacturing processes for vertical surfaces.
Benefits:
- Increased efficiency in photonic systems.
- Enhanced performance of integrated photonic devices.
- Cost-effective manufacturing of photonic dies.
Commercial Applications: The technology can be utilized in the development of advanced optical communication systems, photonic integrated circuits, and high-performance sensing devices, leading to potential applications in telecommunications, data centers, and medical imaging.
Questions about the Technology: 1. How does the lateral alignment of photonic dies improve system performance? 2. What are the advantages of optically and mechanically intercoupling multiple photonic dies in a system?
Frequently Updated Research: Ongoing research in the field focuses on further optimizing the alignment and intercoupling processes of photonic dies to enhance overall system performance and reliability.
Original Abstract Submitted
An integrated photonic system including multiple photonic dies that are laterally aligned using contact between pairs of vertical surfaces. The vertical surfaces can be manufactured by defining, via photolithography processes for example, the shape of the vertical surfaces. Thereafter, the vertical surfaces can be aligned and engaged, thereby optically and mechanically intercoupling the multiple photonic dies.
