18438658. SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
Kunsil Lee of Hwaseong-si (KR)
Dongkwan Kim of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18438658 titled 'SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS AND METHOD FOR MANUFACTURING THE SAME
The semiconductor package described in the patent application consists of a base structure, a first semiconductor chip, a second semiconductor chip, an adhesive layer, and a molding layer.
- The base structure provides a foundation for the semiconductor chips.
- The first semiconductor chip is positioned over the base structure.
- The second semiconductor chip is placed over the first semiconductor chip.
- An adhesive layer is sandwiched between the first and second semiconductor chips.
- A molding layer covers the first and second semiconductor chips, as well as the adhesive layer, with an interposition portion between the base structure and the first semiconductor chip.
Potential Applications: - This semiconductor package design can be used in various electronic devices such as smartphones, laptops, and IoT devices. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides a secure and reliable packaging solution for semiconductor chips. - Helps in reducing the risk of damage to the chips during handling and operation.
Benefits: - Enhanced protection for semiconductor chips. - Improved durability and longevity of electronic devices. - Better thermal management for the chips.
Commercial Applications: Title: "Innovative Semiconductor Package Design for Enhanced Chip Protection" This technology can be utilized by semiconductor manufacturers, electronics companies, and device manufacturers looking to improve the reliability and performance of their products.
Prior Art: There may be existing patents or publications related to semiconductor packaging techniques involving multiple chips and adhesive layers.
Frequently Updated Research: Stay updated on advancements in semiconductor packaging materials, adhesives, and molding techniques to enhance the performance and reliability of semiconductor packages.
Questions about Semiconductor Package Design: 1. How does the interposition portion in the molding layer contribute to the overall stability of the semiconductor package? 2. What are the potential challenges in scaling up this semiconductor packaging design for mass production?
Original Abstract Submitted
A semiconductor package is disclosed. The semiconductor package includes a base structure, a first semiconductor chip over the base structure, a second semiconductor chip over the first semiconductor chip, an adhesive layer between the first semiconductor chip and the second semiconductor chip, and a molding layer covering the first semiconductor chip, the second semiconductor chip and the adhesive layer, and including an interposition portion interposed between the base structure and the first semiconductor chip.
