18438124. CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME
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CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18438124 titled 'CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME
The circuit board module described in the patent application consists of a first substrate, a second substrate with a first inlet, a first interposer connecting the substrates and creating a first space, a sealing member covering the first inlet, and a filler injected between the substrates. The sealing member has an insertion area for filler injection, and at least one of the substrates or interposer has openings for air introduction and exhaust in the first space.
- The circuit board module includes a unique design with a first interposer that creates a space between substrates for filler injection.
- The sealing member with an insertion area allows for easy injection of filler material into the module.
- The presence of openings in the substrates or interposer enables air circulation within the module for efficient operation.
Potential Applications: - This technology can be used in electronic devices requiring efficient cooling systems. - It can be applied in automotive electronics to enhance performance and reliability.
Problems Solved: - Addresses the need for effective cooling solutions in compact electronic devices. - Improves the thermal management of circuit boards in various applications.
Benefits: - Enhanced cooling efficiency for electronic components. - Improved reliability and performance of electronic devices.
Commercial Applications: Title: Innovative Circuit Board Module for Enhanced Cooling This technology can be utilized in smartphones, laptops, automotive electronics, and industrial control systems to improve thermal management and overall performance.
Prior Art: There is no specific information provided about prior art related to this technology in the patent application.
Frequently Updated Research: There is no information available on frequently updated research relevant to this technology.
Questions about Circuit Board Module: Question 1: How does the sealing member facilitate the injection of filler material into the module? Answer: The sealing member has an insertion area that allows a nozzle to inject the filler material into the first inlet of the module.
Question 2: What are the potential applications of this circuit board module technology? Answer: This technology can be applied in electronic devices, automotive electronics, and industrial control systems to improve thermal management and performance.
Original Abstract Submitted
A circuit board module includes a first substrate, a second substrate provided above the first substrate and including a first inlet, a first interposer provided between the first substrate and the second substrate, the first interposer connecting the first substrate and the second substrate and providing a first space between the first substrate and the second substrate, a sealing member covering the first inlet, and a filler provided between the first substrate and the second substrate, where the sealing member includes an insertion area configured to receive a nozzle that injects the filler to be inserted into the first inlet and at least one of the first substrate, the second substrate and the first interposer includes a first opening configured to introduce air into the first space and a second opening configured to exhaust air from the first space.
