18437444. CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
Contents
- 1 CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE
Organization Name
Inventor(s)
CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18437444 titled 'CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE
Simplified Explanation
The invention provides a chip package structure with a first chip connected to another chip through a first hybrid bonding structure. The first hybrid bonding structure includes a first bonding layer with a first insulation material and multiple first metal solder pads embedded in it, each with a groove structure.
- The chip package structure includes a first chip and a first hybrid bonding structure.
- The first hybrid bonding structure consists of a first bonding layer with a first insulation material and several first metal solder pads embedded in it, each with a groove structure.
- The groove bottom of the groove structure is buried in the first insulation material, while the groove opening is exposed on the surface of the first insulation material.
Potential Applications
This technology can be applied in:
- Semiconductor packaging
- Microelectronics industry
- Advanced electronic devices
Problems Solved
This technology solves issues related to:
- Chip connectivity
- Thermal management
- Miniaturization of electronic devices
Benefits
The benefits of this technology include:
- Improved chip-to-chip connections
- Enhanced thermal performance
- Increased reliability of electronic devices
Potential Commercial Applications
The potential commercial applications of this technology can be seen in:
- Consumer electronics
- Automotive electronics
- Aerospace industry
Possible Prior Art
One possible prior art for this technology could be:
- Existing chip bonding techniques
- Traditional soldering methods
=== What are the specific materials used in the first bonding layer of the chip package structure? The specific materials used in the first bonding layer are a first insulation material and multiple first metal solder pads embedded in it, each with a groove structure.
=== How does the groove structure of the first metal solder pads contribute to the overall functionality of the chip package structure? The groove structure of the first metal solder pads allows for better adhesion and connectivity between the chips, enhancing the overall performance and reliability of the chip package structure.
Original Abstract Submitted
The invention provide a chip package structure, which includes a first chip and a first hybrid bonding structure. The first chip is connected to another chip through the first hybrid bonding structure. The first hybrid bonding structure includes a first bonding layer. The first bonding layer is disposed on a side away from a substrate of the first chip, and the first bonding layer includes a first insulation material and a plurality of first metal solder pads embedded in the first insulation material. Each of the plurality of first metal solder pads includes a groove structure. A groove bottom of the groove structure is buried in the first insulation material, and a groove opening of the groove structure is exposed to a surface of the first insulation material and is flush with the surface of the first insulation material.
