18437385. THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Seunggeol Ryu of Seoul (KR)

Seokkan Ki of Suwon-si (KR)

Youngsuk Nam of Yongin-si (KR)

Jaechoon Kim of Incheon (KR)

Bangweon Lee of Yongin-si (KR)

Seungtae Hwang of Seoul (KR)

THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18437385 titled 'THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

Simplified Explanation

The method involves treating fine particles with an acidic solution to remove oxide layers, injecting liquid metal to remove oxide layers from its surface, allowing the particles to penetrate the liquid metal, and extracting the mixture from the solution.

  • Fine particles are mixed with an acidic solution to remove oxide layers.
  • Liquid metal is injected to remove oxide layers from its surface.
  • The fine particles penetrate the liquid metal.
  • The mixture is then extracted from the solution.

Key Features and Innovation

  • Novel method of manufacturing thermal interface material.
  • Acidic solution used to remove oxide layers from particles.
  • Liquid metal used to remove oxide layers from its surface.
  • Enhanced thermal conductivity due to the interaction between particles and liquid metal.

Potential Applications

This technology can be used in:

  • Electronics industry for thermal management.
  • Automotive industry for heat dissipation in engines.
  • Aerospace industry for thermal control in spacecraft.

Problems Solved

  • Improved thermal conductivity.
  • Enhanced heat dissipation.
  • Better performance of electronic devices.

Benefits

  • Increased efficiency in thermal management.
  • Extended lifespan of electronic components.
  • Enhanced overall performance of systems.

Commercial Applications

  • "Innovative Method for Thermal Interface Material Manufacturing" can revolutionize the electronics, automotive, and aerospace industries by providing superior thermal management solutions.

Prior Art

No prior art information available at this time.

Frequently Updated Research

No frequently updated research information available at this time.

Questions about Innovative Method for Thermal Interface Material Manufacturing

Question 1

How does the interaction between fine particles and liquid metal improve thermal conductivity?

The interaction between fine particles and liquid metal allows for better heat transfer due to the removal of oxide layers and the penetration of particles into the metal, creating a more efficient thermal interface.

Question 2

What are the potential long-term effects of using this method in electronic devices?

The potential long-term effects include improved performance, increased reliability, and extended lifespan of electronic devices due to better heat dissipation and thermal management.


Original Abstract Submitted

A method of manufacturing a thermal interface material may include mixing fine particles with an acidic solution to remove a first oxide layer from a surface of each of the fine particles, injecting a liquid metal into the acidic solution to remove a second oxide layer from a surface of the liquid metal and for the fine particles from which the first oxide layer is removed in the acidic solution to penetrate into the liquid metal from which the second oxide layer is remove, and extracting the liquid metal including the fine particles therein from the acidic solution.