18437139. SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chui-Ya Peng of Hsinchu City (TW)
SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18437139 titled 'SYSTEMS AND METHODS FOR IN-SITU MARANGONI CLEANING
Simplified Explanation
The abstract describes a method for cleaning wafers in a chamber by immersing them in a bath, removing them with a solvent, analyzing a parameter value from the gas, and performing remediation if the value is beyond a threshold.
- Immersing wafer in bath within cleaning chamber
- Removing wafer with solvent into gas in cleaning chamber
- Determining parameter value from gas
- Performing remediation if parameter value is beyond threshold
Potential Applications
The technology described in the patent application could be applied in the semiconductor industry for cleaning wafers used in the manufacturing of electronic devices.
Problems Solved
This technology solves the problem of efficiently and effectively cleaning wafers in a controlled environment to ensure high-quality production in the semiconductor industry.
Benefits
The benefits of this technology include improved cleanliness of wafers, increased efficiency in the manufacturing process, and potentially higher yields of quality electronic devices.
Potential Commercial Applications
- Semiconductor Wafer Cleaning Technology for Enhanced Production
Possible Prior Art
There may be prior art related to wafer cleaning processes in the semiconductor industry, but specific examples are not provided in this context.
Unanswered Questions
How does this method compare to traditional wafer cleaning processes in terms of efficiency and effectiveness?
The article does not provide a direct comparison between this method and traditional wafer cleaning processes, leaving room for further exploration and analysis.
What are the specific threshold values used to determine when remediation is required in the cleaning chamber?
The abstract does not specify the exact threshold values for the parameter that triggers the need for remediation, which could be important for understanding the effectiveness of the process.
Original Abstract Submitted
In an embodiment, a method includes: immersing a wafer in a bath within a cleaning chamber, removing the wafer out of the bath through a solvent and into a gas within the cleaning chamber, determining a parameter value from the gas; and performing remediation within the cleaning chamber in response to determining that the parameter value is beyond a threshold value.
