18436248. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
- 1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Yoshinori Ikeda of Koshi City (JP)
Toru Hirata of Koshi City (JP)
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18436248 titled 'SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Simplified Explanation
The substrate processing apparatus described in the patent application includes a holder for horizontally holding a substrate, a rotator for rotating the holder, a liquid supplier for supplying liquid to the substrate, and a controller for controlling the holder, rotator, and liquid supplier. The holder consists of a turntable, at least one first clamper, and at least one second clamper. The first clamper is rotated with the turntable and moves between clamping and releasing positions, while the second clamper moves independently of the first clamper. The controller alternately clamps the peripheral edge of the substrate while the holder is rotated and liquid is supplied to the substrate.
- The substrate processing apparatus includes a holder, rotator, liquid supplier, and controller.
- The holder has a turntable, at least one first clamper, and at least one second clamper.
- The first clamper moves between clamping and releasing positions, while the second clamper moves independently.
- The controller alternately clamps the substrate's edge while rotating the holder and supplying liquid.
Potential Applications
The technology described in this patent application could be used in semiconductor manufacturing, LCD panel production, and other industries requiring precise substrate processing.
Problems Solved
This technology solves the problem of efficiently and accurately processing substrates by providing a mechanism for clamping the substrate's edge while rotating it and supplying liquid.
Benefits
The benefits of this technology include improved substrate processing efficiency, higher precision in liquid application, and reduced risk of substrate damage during processing.
Potential Commercial Applications
- Semiconductor manufacturing equipment with improved substrate processing capabilities
- LCD panel production machinery for more precise liquid application
Possible Prior Art
One possible prior art for this technology could be similar substrate processing apparatus with less efficient clamping mechanisms or limited control over the clamping process.
Unanswered Questions
How does the controller determine the optimal clamping frequency for the substrate?
The patent application does not provide specific details on how the controller calculates the ideal clamping frequency for the substrate during processing.
What materials are suitable for the clamper components to ensure durability and reliability?
The patent application does not mention the specific materials used for the clamper components and their suitability for long-term use in substrate processing applications.
Original Abstract Submitted
A substrate processing apparatus includes a holder for holding a substrate horizontally, a rotator for rotating the holder, a liquid supplier for supplying liquid to the substrate, and a controller for controlling the holder, the rotator, and the liquid supplier. The holder includes a turntable configured to be rotated by the rotator, at least one first clamper configured to be rotated together with the turntable and moved between a clamping position and a releasing position, and at least one second clamper configured to be rotated with the turntable and moved between the clamping and releasing positions independently of the at least one first clamper. The controller controls the at least one first clamper and the at least one second clamper to alternately clamp the peripheral edge of the substrate while the holder is being rotated by the rotator and the liquid is being supplied to the substrate.
