18435741. TEMPERATURE CONTROL FOR MULTIPLE DIE TYPES IN A COMMON PACKAGE simplified abstract (Cisco Technology, Inc.)
Contents
- 1 TEMPERATURE CONTROL FOR MULTIPLE DIE TYPES IN A COMMON PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TEMPERATURE CONTROL FOR MULTIPLE DIE TYPES IN A COMMON PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
TEMPERATURE CONTROL FOR MULTIPLE DIE TYPES IN A COMMON PACKAGE
Organization Name
Inventor(s)
Mark A. Gustlin of Campbell CA (US)
Rakesh Chopra of Menlo Park CA (US)
TEMPERATURE CONTROL FOR MULTIPLE DIE TYPES IN A COMMON PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18435741 titled 'TEMPERATURE CONTROL FOR MULTIPLE DIE TYPES IN A COMMON PACKAGE
Simplified Explanation
The abstract describes a patent application for techniques to control the temperature of multiple dies in an element. The temperature of a first die is measured, and the temperature is adjusted by transferring activity from a second die to the first die based on target and measured temperatures.
- Techniques for temperature control in multiple dies:
* Measure temperature of first die * Adjust temperature by transferring activity from second die * Based on target and measured temperatures
Potential Applications
The technology could be applied in:
- Electronic devices
- Semiconductor manufacturing
- Automotive industry
Problems Solved
This technology addresses issues such as:
- Overheating of electronic components
- Inefficient temperature control in multiple dies
- Uneven temperature distribution
Benefits
The benefits of this technology include:
- Improved performance and reliability of electronic devices
- Enhanced thermal management in semiconductor manufacturing
- Increased efficiency in temperature control systems
Potential Commercial Applications
This technology could be commercially benefit:
- Electronics manufacturers
- Semiconductor companies
- Automotive manufacturers
Possible Prior Art
One possible prior art is the use of heat sinks and fans for cooling electronic components. Another could be the use of thermal paste to improve heat transfer in semiconductor devices.
Unanswered Questions
How does this technology compare to traditional methods of temperature control in electronic devices?
This article does not provide a direct comparison between this technology and traditional methods of temperature control. It would be interesting to know the efficiency and effectiveness of this new technique compared to existing solutions.
What are the potential limitations or drawbacks of implementing this temperature control technique in practical applications?
The article does not address any potential limitations or drawbacks of implementing this technology. It would be important to understand any challenges that may arise when applying this technique in real-world scenarios.
Original Abstract Submitted
Techniques for temperature control for multiple dies in an element. A temperature of a first die is measured, in an element including the first die and a second die. The second die includes at least a portion of a controller. The temperature of the first die is changed by adjusting activity, from the second die to the first die, based on a target temperature for the first die and the measured temperature for the first die.
