18435699. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE simplified abstract (ROHM CO., LTD.)
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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18435699 titled 'SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
The present disclosure introduces a semiconductor device with a unique structure.
- The semiconductor device consists of a substrate, an element insulating layer, and a semiconductor resistive layer.
- The semiconductor resistive layer is positioned within the element insulating layer and extends perpendicular to the substrate's thickness direction.
- The semiconductor resistive layer features an uneven portion along the thickness direction, providing a distinct characteristic to the device.
Potential Applications: - This technology could be utilized in the development of advanced electronic devices. - It may find applications in the semiconductor industry for improved performance.
Problems Solved: - Enhances the functionality and efficiency of semiconductor devices. - Offers a new approach to semiconductor device design.
Benefits: - Improved performance and functionality. - Enhanced design flexibility in semiconductor devices.
Commercial Applications: Title: Innovative Semiconductor Device Technology for Enhanced Performance This technology could be applied in the production of high-performance electronic devices, catering to industries such as telecommunications, computing, and consumer electronics.
Prior Art: Readers can explore prior research on semiconductor device structures and resistive materials to gain a deeper understanding of the innovation presented in this disclosure.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor device technology and materials to further enhance the understanding and potential applications of this innovation.
Questions about Semiconductor Device Technology: 1. How does the uneven portion of the semiconductor resistive layer impact the device's performance?
- The uneven portion of the semiconductor resistive layer introduces unique properties that can enhance the device's functionality in specific applications.
2. What are the potential challenges in integrating this semiconductor device technology into existing electronic systems?
- Integrating this technology may require compatibility assessments with current electronic systems and could pose challenges in terms of implementation and scalability.
Original Abstract Submitted
The present disclosure provides a semiconductor device. The semiconductor device includes: a substrate; an element insulating layer, disposed on the substrate; and a semiconductor resistive layer, disposed within the element insulating layer. The semiconductor resistive layer extends along a first direction perpendicular to a thickness direction of the substrate and includes an uneven portion along the thickness direction.
