18435689. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
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Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
HYUNGGIL Baek of Suwon-si (KR)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 18435689 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
A semiconductor package includes a package substrate, a semiconductor chip that is bonded to the package substrate, and a stiffener that is adjacent to the semiconductor chip and is bonded to the package substrate. The stiffener includes a plurality of corner parts that are bonded to a plurality of corner regions of the package substrate, and a plurality of leg parts that are spaced apart from the package substrate. Each of the plurality of leg parts connects corresponding two leg parts of the plurality of leg parts with each other.
