18435425. SEMICONDUCTOR DEVICE simplified abstract (Renesas Electronics Corporation)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Renesas Electronics Corporation
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18435425 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract consists of a semiconductor substrate with multiple interlayer dielectric films and wiring layers stacked above the first main surface. A trench is formed on the first main surface, extending towards the second main surface, with a straight portion along a specific direction. The wiring layers include a first wiring layer farthest from the first main surface and a second wiring layer next to the first wiring layer.
- The semiconductor device includes a semiconductor substrate with interlayer dielectric films and wiring layers.
- A trench is formed on the first main surface, extending towards the second main surface.
- The wiring layers consist of a first wiring layer farthest from the first main surface and a second wiring layer next to it.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices. - It can improve the performance and efficiency of electronic devices.
Problems Solved: - Enhances the functionality and reliability of semiconductor devices. - Provides a more efficient way to design and manufacture electronic components.
Benefits: - Improved performance and efficiency of electronic devices. - Enhanced reliability and functionality of semiconductor devices.
Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and other consumer electronics. It can also be applied in the automotive industry for advanced driver assistance systems and in the aerospace sector for avionics.
Questions about Semiconductor Device Technology: 1. How does this technology impact the efficiency of electronic devices? 2. What are the potential applications of this semiconductor device technology in the automotive industry?
Frequently Updated Research: Researchers are constantly exploring new materials and manufacturing techniques to further improve the performance and efficiency of semiconductor devices. Stay updated on the latest advancements in the field to leverage the full potential of this technology.
Original Abstract Submitted
A semiconductor device includes a semiconductor substrate having a first main surface and a second main surface, a plurality of interlayer dielectric films, and a plurality of wiring layers stacked above the first main surface. Each of the plurality of interlayer dielectric films is interposed between two adjacent ones of the plurality of wiring layers and between one of the plurality of wiring layers closest to the first main surface in a first direction and the first main surface. A trench recessed toward the second main surface is formed on the first main surface. The trench includes a straight portion extending along a second direction. The plurality of wiring layers has a first wiring layer farthest from the first main surface in the first direction and a second wiring layer farthest from the first main surface next to the first wiring layer in the first direction.
