18434842. RADIO-FREQUENCY MODULE simplified abstract (Murata Manufacturing Co., Ltd.)

RADIO-FREQUENCY MODULE

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Yukiya Yamaguchi of Nagaokakyo-shi (JP)

Atsushi Horita of Nagaokakyo-shi (JP)

Hiroki Shounai of Nagaokakyo-shi (JP)

RADIO-FREQUENCY MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18434842 titled 'RADIO-FREQUENCY MODULE

Simplified Explanation

The radio-frequency module described in the patent application includes a module substrate with electronic components disposed on both major surfaces, including an integrated circuit with a control circuit and a capacitor connected to the power supply terminal and ground.

• The radio-frequency module includes a module substrate with electronic components on both major surfaces.
• An integrated circuit with a control circuit is connected to the power supply terminal.
• A capacitor is connected between the power supply terminal and ground.
• The integrated circuit is positioned closer to the capacitor than any other electronic component on the second major surface.

Potential Applications

The technology described in this patent application could be applied in:

• Wireless communication devices
• RFID systems
• Satellite communication systems

Problems Solved

This technology helps in:

• Improving power supply efficiency
• Enhancing signal transmission quality
• Reducing interference in radio-frequency modules

Benefits

The benefits of this technology include:

• Better performance of electronic components
• Increased reliability of radio-frequency modules
• Enhanced overall system efficiency

Potential Commercial Applications

Potential commercial applications of this technology could be in:

• Telecommunications industry
• IoT devices
• Aerospace and defense sector

Possible Prior Art

One possible prior art related to this technology is the use of capacitors in radio-frequency modules to stabilize power supply and reduce noise interference.

How does this technology impact the size of radio-frequency modules?

The patent application does not provide information on whether this technology affects the size of radio-frequency modules. Further research is needed to determine if there are any size implications.

What is the cost-effectiveness of implementing this technology in electronic devices?

The patent application does not discuss the cost-effectiveness of integrating this technology into electronic devices. Future studies could explore the economic implications of adopting this innovation.

Original Abstract Submitted

A radio-frequency module includes a module substrate including a first major surface opposite to a second major surface, a plurality of electronic components disposed at the first major surface and at the second major surface, and a power supply terminal disposed at the second major surface. The plurality of electronic components include an integrated circuit disposed at the second major surface and including a control circuit coupled to the power supply terminal. The plurality of electronic components also include a capacitor disposed at the second major surface and coupled between a path connecting the power supply terminal to the control circuit and ground. The integrated circuit is disposed closer to the capacitor than any other electronic component disposed at the second major surface and/or the capacitor is disposed closer to the integrated circuit than any other electronic component disposed at the second major surface.