18434757. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hsien-Wei Chen of Hsinchu City (TW)
An-Jhih Su of Taoyuan City (TW)
Li-Hsien Huang of Hsinchu County (TW)
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18434757 titled 'PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The abstract of the patent application describes a device with a die encapsulated by an encapsulant, a conductive structure, and a dielectric layer. The conductive structure includes a through via, a redistribution line layer, and a seed layer. The dielectric layer has an opening with a scallop sidewall and an included angle larger than 60 degrees.
- Device includes die, encapsulant, conductive structure, and dielectric layer
- Conductive structure consists of through via, redistribution line layer, and seed layer
- Dielectric layer has opening with scallop sidewall and included angle over 60 degrees
Potential Applications
This technology could be applied in:
- Semiconductor packaging
- Integrated circuits
- Electronic devices
Problems Solved
This technology helps in:
- Enhancing electrical connectivity
- Improving signal transmission
- Increasing device reliability
Benefits
The benefits of this technology include:
- Better performance
- Increased efficiency
- Enhanced durability
Potential Commercial Applications
This technology could be used in:
- Consumer electronics
- Telecommunications
- Automotive industry
Possible Prior Art
One possible prior art for this technology could be:
- Existing semiconductor packaging methods
- Traditional dielectric layer structures
Unanswered Questions
How does this technology compare to existing packaging methods?
This article does not provide a direct comparison with existing packaging methods.
What specific electronic devices could benefit the most from this technology?
The article does not specify which electronic devices could benefit the most from this technology.
Original Abstract Submitted
Device, package structure and method of forming the same are disclosed. The device includes a die encapsulated by an encapsulant, a conductive structure aside the die, and a dielectric layer overlying the conductive structure. The conductive structure includes a through via in the encapsulant, a redistribution line layer overlying the through via, and a seed layer overlying the redistribution line layer. The dielectric layer includes an opening, wherein the opening exposes a surface of the conductive structure, the opening has a scallop sidewall, and an included angle between a bottom surface of the dielectric layer and a sidewall of the opening is larger than about 60 degrees.
