18434357. MICROMECHANICAL COMPONENT simplified abstract (Robert Bosch GmbH)
Contents
MICROMECHANICAL COMPONENT
Organization Name
Inventor(s)
Jan Stiedl of Pliezhausen (DE)
MICROMECHANICAL COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18434357 titled 'MICROMECHANICAL COMPONENT
Simplified Explanation:
The patent application describes a micromechanical component with a printed circuit board, an ASIC chip, a MEMS chip, and an adapter chip arranged in a specific configuration.
- The component includes a printed circuit board with an ASIC chip and a MEMS chip arranged parallel to the main extension plane.
- The ASIC chip is positioned above the printed circuit board, while the MEMS chip is above the ASIC chip.
- The ASIC chip is electrically connected to the printed circuit board using bonding wires in a bonding region.
- An adapter chip is placed between the ASIC chip and the MEMS chip, covering part of the bonding region in the z-direction.
- The method for producing this component is also detailed in the patent application.
Key Features and Innovation:
- Configuration of a micromechanical component with a specific arrangement of chips.
- Use of an adapter chip to cover the bonding region between the ASIC and MEMS chips.
- Method for producing the micromechanical component.
Potential Applications:
- Microelectronics
- MEMS technology
- Sensor applications
Problems Solved:
- Efficient arrangement of chips in a micromechanical component.
- Protection of bonding region during assembly.
Benefits:
- Improved performance of micromechanical components.
- Enhanced reliability of electrical connections.
- Simplified production process.
Commercial Applications:
Micromechanical components with this configuration could be used in various industries such as consumer electronics, automotive, aerospace, and medical devices.
Questions about Micromechanical Components: 1. What are the key components of a micromechanical component? 2. How does the arrangement of chips impact the performance of the component?
Original Abstract Submitted
A micromechanical component having a printed circuit board with a main extension plane, having an ASIC chip and a MEMS chip, which are arranged parallel to the main extension plane, wherein the ASIC chip is arranged above the printed circuit board, and the MEMS chip is arranged above the ASIC chip, wherein the ASIC chip is electrically contacted to the printed circuit board in a bonding region by bonding wires. An adapter chip is arranged between the ASIC chip and the MEMS chip, which adapter chip at least partially covers the bonding region in a z-direction perpendicular to the main extension plane. A method for producing a micromechanical component is also described.
