18434347. LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract (Intel Corporation)

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LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

Organization Name

Intel Corporation

Inventor(s)

Kristof Darmawikarta of Chandler AZ (US)

Hiroki Tanaka of Chandler AZ (US)

Robert May of Chandler AZ (US)

Sameer Paital of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Jesse Jones of Chandler AZ (US)

Chung Kwang Christopher Tan of Chandler AZ (US)

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18434347 titled 'LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

Simplified Explanation

The abstract describes an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. It involves layers of organic material, a cavity, a bridge substrate, and multiple dies electrically coupled through the bridge substrate.

  • The electronic package includes a first layer made of organic material and a second layer on top of it.
  • A cavity is formed through the second layer to expose the first layer's surface.
  • A bridge substrate is placed in the cavity, supported by the first layer's surface.
  • A first die is electrically coupled to a first contact on the bridge substrate, and a second die is electrically coupled to a second contact on the bridge substrate.
  • The first die is electrically coupled to the second die through the bridge substrate.

Potential Applications

The technology described in the patent application could be used in:

  • High-performance computing systems
  • Data centers
  • Telecommunications equipment

Problems Solved

This technology helps in:

  • Improving electrical connectivity in electronic packages
  • Reducing signal loss and interference
  • Enhancing overall system performance

Benefits

The benefits of this technology include:

  • Increased reliability of electronic packages
  • Higher data transfer speeds
  • Enhanced thermal management

Potential Commercial Applications

The potential commercial applications of this technology could be in:

  • Semiconductor industry
  • Electronics manufacturing sector
  • Telecommunication equipment production

Possible Prior Art

One possible prior art related to this technology is the use of interposer technology in electronic packaging to improve signal integrity and reduce power consumption.

Unanswered Questions

How does this technology compare to existing interconnect solutions in terms of cost-effectiveness?

The article does not provide information on the cost implications of implementing this technology compared to other interconnect solutions.

What are the environmental impacts of using this technology in electronic devices?

The environmental sustainability aspects of using this technology are not addressed in the article.


Original Abstract Submitted

Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.

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