18433910. SEMICONDUCTOR MODULE simplified abstract (DENSO CORPORATION)
Contents
SEMICONDUCTOR MODULE
Organization Name
Inventor(s)
Shingo Iwasaki of Kariya-city (JP)
SEMICONDUCTOR MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18433910 titled 'SEMICONDUCTOR MODULE
Simplified Explanation
The semiconductor module described in the patent application integrates semiconductor switching elements for an inverter circuit, bus bars, and a mold that seals the components together on a circuit board. The switching elements are arranged in a plane on the circuit board, with bus bars connecting them in each leg of the inverter circuit.
- The semiconductor module includes a circuit board, semiconductor switching elements, bus bars, and a mold.
- The switching elements are arranged in a plane on the circuit board.
- Bus bars connect the switching elements in each leg of the inverter circuit.
- The bus bars include a first bus bar serially connecting the switching elements and a second bus bar connected to a high or low potential side of the leg.
- The first and second bus bars overlap and have opposite current flow directions.
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- Potential Applications
This technology could be applied in various power electronics systems, such as motor drives, renewable energy systems, and industrial automation equipment.
- Problems Solved
This innovation helps in improving the efficiency and reliability of power electronics systems by providing a compact and integrated solution for connecting semiconductor switching elements in an inverter circuit.
- Benefits
- Enhanced efficiency in power conversion systems - Improved reliability and durability of semiconductor modules - Compact design for space-saving in electronic devices
- Potential Commercial Applications
"Integrated Semiconductor Module for Power Electronics Systems" could find applications in electric vehicles, solar inverters, wind turbines, and UPS systems.
- Possible Prior Art
One possible prior art could be the use of discrete components and wiring connections in traditional power electronics modules, which may not offer the same level of integration and compactness as the described semiconductor module.
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- Unanswered Questions
- How does this technology compare to existing integrated semiconductor modules in terms of cost-effectiveness?
The patent application does not provide specific details on the cost implications of implementing this technology compared to other integrated semiconductor modules.
- What are the environmental impacts of manufacturing and disposing of the semiconductor module?
The environmental sustainability aspects of producing and disposing of the semiconductor module are not addressed in the patent application.
Original Abstract Submitted
A semiconductor module includes a circuit board, semiconductor switching elements for an inverter circuit connected to the circuit board, bus bars, and a mold integrally sealing the circuit board, the semiconductor switching elements, and the bus bars. The switching elements are disposed in a plane direction of the circuit board. The bus bars include a first bus bar serially connecting the switching elements in each leg of the inverter circuit to each other and a second bus bar connected to a high potential side or a low potential side of the leg and disposed between the first bus bar and the circuit board. The first bus bar and the second bus bar at least partly overlap. The direction of a current flowing through the first bus bar is opposite to the direction of a current flowing through the second bus bar.
