18433436. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Tsung-Shu Lin of New Taipei City (TW)
Wensen Hung of Hsinchu County (TW)
Tsung-Yu Chen of Hsinchu City (TW)
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18433436 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
The manufacturing method of a semiconductor package involves providing a package structure over a substrate, a thermal interface layer over the package structure, and a lid structure over the substrate. The lid structure includes a main body in contact with the package structure through the thermal interface layer, surrounding the package structure, and a plurality of rib portions protruding from the main body towards the package structure.
- Package structure provided over a substrate
- Thermal interface layer provided over the package structure
- Lid structure comprising a main body and rib portions
- Main body in contact with the package structure through the thermal interface layer
- Rib portions protruding from the main body towards the package structure
Potential Applications: - Semiconductor packaging industry - Electronics manufacturing
Problems Solved: - Enhanced thermal management in semiconductor packages - Improved structural integrity
Benefits: - Better heat dissipation - Increased reliability of semiconductor packages
Commercial Applications: - Semiconductor manufacturing companies - Electronics industry suppliers
Questions about Semiconductor Package Manufacturing: 1. How does the lid structure improve thermal management in semiconductor packages? 2. What are the potential market implications of this manufacturing method in the electronics industry?
Frequently Updated Research: - Ongoing studies on advanced materials for thermal interface layers in semiconductor packaging.
Original Abstract Submitted
A manufacturing method of a semiconductor package includes the following steps. A package structure is provided over a substrate. A thermal interface layer is provided over the package structure. A lid structure is provided over the substrate, wherein the lid structure comprises a main body in contact with the package structure through the thermal interface layer and surrounding the package structure and a plurality of rib portions protruded from the main body and extended toward the package structure.
