18433228. METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOOTPRINT simplified abstract (SKYWORKS SOLUTIONS, INC.)
Contents
METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOOTPRINT
Organization Name
Inventor(s)
Howard E. Chen of Anaheim CA (US)
Robert Francis Darveaux of Corona Del Mar CA (US)
Anthony James Lobianco of Irvine CA (US)
METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOOTPRINT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18433228 titled 'METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOOTPRINT
In some embodiments, a method for manufacturing packaged radio-frequency devices includes providing a packaging substrate with a first side and a second side, mounting components on each side, implementing overmold structures to encapsulate the components, and creating through-mold connections for signal and ground pins.
- Packaging substrate configured to receive multiple components
- Mounting components on both sides of the substrate
- Overmold structures to encapsulate components
- Through-mold connections for signal and ground pins
- Redundant pins and ground pads for added reliability
Potential Applications: - Manufacturing of radio-frequency devices - Electronics industry for improved packaging techniques
Problems Solved: - Enhanced reliability and durability of packaged devices - Efficient encapsulation of components for protection
Benefits: - Increased reliability of radio-frequency devices - Improved protection of components - Enhanced manufacturing efficiency
Commercial Applications: Title: Advanced Packaging Method for Radio-Frequency Devices This technology can be utilized in the electronics industry for manufacturing radio-frequency devices with improved reliability and durability. The market implications include increased demand for high-quality packaged devices in various applications.
Questions about the technology: 1. How does this method improve the reliability of radio-frequency devices? 2. What are the key advantages of using through-mold connections in packaging substrates?
Original Abstract Submitted
In some embodiments, a method for manufacturing packaged radio-frequency devices includes: providing a packaging substrate configured to receive a plurality of components, including a first side and a second side; mounting a first component on the first side of the packaging substrate; implementing a first overmold structure on the first side of the packaging substrate, substantially encapsulating the first component; mounting a second component on the second side of the packaging substrate, the second component being located in an area of the second side where one or more redundant pins, a redundant ground pad, or a redundant portion of a ground pad may be located; implementing a set of through-mold connections on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins; and implementing a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.
