18433047. PROXIMITY SENSOR simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
- 1 PROXIMITY SENSOR
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PROXIMITY SENSOR - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PROXIMITY SENSOR
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Sreenivasan Kalyani Koduri of DALLAS TX (US)
Leslie Edward Stark of Heath TX (US)
PROXIMITY SENSOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 18433047 titled 'PROXIMITY SENSOR
Simplified Explanation
The abstract describes a packaged integrated circuit (IC) with a lead frame, semiconductor dies containing first and second circuits, and a molding compound encapsulating the lead frame and dies with cavities containing a different material.
- Lead frame
- Semiconductor dies with first and second circuits
- Molding compound encapsulating the lead frame and dies
- Cavities in the molding compound with a different material
Potential Applications
The technology described in this patent application could be applied in various industries such as electronics, telecommunications, automotive, and consumer electronics for manufacturing integrated circuits with improved performance and reliability.
Problems Solved
This technology solves the problem of protecting semiconductor dies and lead frames from external elements such as moisture, dust, and mechanical stress, which can affect the functionality and lifespan of the integrated circuits.
Benefits
The benefits of this technology include enhanced durability, improved electrical performance, and increased resistance to environmental factors, leading to higher quality and more reliable integrated circuits.
Potential Commercial Applications
- "Enhanced Integrated Circuit Packaging Technology for Improved Performance and Reliability"
Possible Prior Art
One possible prior art in this field is the use of traditional molding compounds for encapsulating integrated circuits, which may not provide the same level of protection and performance as the technology described in this patent application.
Unanswered Questions
What specific industries could benefit the most from this technology?
The article mentions various industries, but a more detailed analysis of which specific sectors within those industries could benefit the most would provide valuable insights.
How does the use of a different material in the cavities improve the overall performance of the integrated circuit?
While the abstract mentions the presence of a different material, it does not elaborate on how this contributes to the functionality and reliability of the integrated circuit.
Original Abstract Submitted
A packaged integrated circuit (IC), comprising: a lead frame; one or more semiconductor dies on the lead frame, the one or more semiconductor dies including a first circuit and a second circuit; and a molding compound encapsulating the lead frame and the semiconductor die, the molding compound including a first cavity over the first circuit and a second cavity over the second circuit, in which at least one of the first or second cavities includes a second material different from the molding compound.
