18432788. SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT simplified abstract (SK hynix Inc.)
Contents
- 1 SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT
Organization Name
Inventor(s)
Chan Ho Yoon of Icheon-si (KR)
SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18432788 titled 'SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT
Simplified Explanation
The semiconductor device described in the abstract consists of two chips stacked on top of each other, with pads and resistor elements defined on each chip and coupled together.
- A first pad is defined on one surface of a first chip.
- A second pad is defined on one surface of a second chip, which is stacked on the first chip and bonded to the first pad.
- A first resistor element is defined in the first chip and coupled to the first pad.
- A second resistor element is defined in the second chip and coupled to the second pad.
Potential Applications
This technology could be applied in various electronic devices such as sensors, actuators, and communication systems.
Problems Solved
This technology allows for compact and efficient integration of multiple resistor elements in a semiconductor device, enabling improved performance and functionality.
Benefits
The stacked configuration of chips with resistor elements and pads provides a space-saving solution for complex electronic circuits, enhancing overall device performance.
Potential Commercial Applications
- "Innovative Stacked Semiconductor Device for Enhanced Circuit Integration"
Possible Prior Art
There may be prior art related to stacked semiconductor devices with integrated resistor elements, but specific examples are not provided in this context.
Unanswered Questions
How does this technology impact the overall size of electronic devices?
This technology enables a more compact design for electronic devices by integrating multiple resistor elements in a stacked configuration, potentially reducing the overall size of the device.
What are the potential challenges in manufacturing semiconductor devices with stacked chips?
Manufacturing processes for stacked semiconductor devices may require precise alignment and bonding techniques to ensure proper functionality and performance.
Original Abstract Submitted
A semiconductor device includes a first pad defined on one surface of a first chip; a second pad defined on one surface of a second chip which is stacked on the first chip, and bonded to the first pad; a first resistor element defined in the first chip, and coupled to the first pad; and a second resistor element defined in the second chip, and coupled to the second pad.
