18432353. PACKAGE STRUCTURE HAVING LINE CONNECTED VIA PORTIONS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

PACKAGE STRUCTURE HAVING LINE CONNECTED VIA PORTIONS

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chih-Kai Cheng of Chu-dong Villiage (TW)

Tsung-Shu Lin of New Taipei City (TW)

Tsung-Yu Chen of Hsinchu City (TW)

Hsien-Pin Hu of Zhubei City (TW)

Wen-Hsin Wei of Hsinchu City (TW)

PACKAGE STRUCTURE HAVING LINE CONNECTED VIA PORTIONS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18432353 titled 'PACKAGE STRUCTURE HAVING LINE CONNECTED VIA PORTIONS

The abstract describes a package structure and method for forming the same, which includes a substrate with a die on the back surface, a first through via structure, a conductive structure in a passivation layer over the front surface, and a connector formed over the via portion.

• The package structure includes a substrate with a die on the back surface.
• A first through via structure is formed in the substrate.
• A conductive structure is formed in a passivation layer over the front surface of the substrate.
• The conductive structure includes a via portion in direct contact with the substrate.
• A connector is formed over the via portion, with an extending portion directly on a recessed top surface of the via portion.

Potential Applications: - Semiconductor packaging - Electronics manufacturing

Problems Solved: - Enhanced connectivity in package structures - Improved reliability and performance of electronic devices

Benefits: - Increased efficiency in electronic device manufacturing - Enhanced durability and connectivity in package structures

Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Connectivity This technology can be used in the semiconductor industry to improve the performance and reliability of electronic devices. It has applications in various electronic products, including smartphones, computers, and automotive electronics.

Questions about the technology: 1. How does this package structure improve the reliability of electronic devices? 2. What are the key advantages of using this method for forming package structures?

Original Abstract Submitted

A package structure and method for forming the same are provided. The package structure includes a substrate having a front surface and a back surface, and a die formed on the back surface of the substrate. The package structure includes a first through via structure formed in the substrate, a conductive structure formed in a passivation layer) over the front surface of the substrate. The conductive structure includes a via portion in direct contact with the substrate. The package structure includes a connector (formed over the via portion, wherein the connector includes an extending portion directly on a recessed top surface of the via portion.