18432021. ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
Contents
ELECTRONIC DEVICE
Organization Name
Inventor(s)
Jen-Hai Chi of Miaoli County (TW)
Shun-Yuan Hu of Miaoli County (TW)
ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18432021 titled 'ELECTRONIC DEVICE
The abstract of the patent application describes an electronic device with a circuit substrate, an electronic element, and a connection layer that connects bonding pads on the substrate and the element.
- The circuit substrate has first bonding pads, while the electronic element has second bonding pads.
- The connection layer includes a first portion, a second portion, and a third portion.
- The second portion overlaps with a projection region of the second bonding pad on the substrate.
- The first portion is away from another first bonding pad and does not overlap with the projection region.
- The third portion is adjacent to the another first bonding pad and does not overlap with the projection region.
- The widths of the first and third portions are different.
- Potential Applications:
- This technology can be used in the manufacturing of electronic devices such as smartphones, tablets, and computers. - It can also be applied in the automotive industry for vehicle electronics and control systems.
- Problems Solved:
- Provides a reliable and efficient way to connect electronic elements to circuit substrates. - Ensures proper alignment and connection between bonding pads.
- Benefits:
- Improved performance and reliability of electronic devices. - Simplifies the manufacturing process and reduces production costs.
- Commercial Applications:
- Title: Advanced Electronic Device Connection Technology
- Commercial Applications:
This technology can be utilized by electronics manufacturers to enhance the quality and efficiency of their products. It can lead to the development of more reliable and durable electronic devices, ultimately attracting more customers and increasing market share.
- Prior Art:
There may be prior art related to microelectronics packaging, semiconductor bonding, and electronic interconnect technologies that could provide valuable insights into similar innovations.
- Frequently Updated Research:
Researchers in the field of microelectronics and semiconductor technology are constantly exploring new methods and materials for improving electronic device connections. Stay updated on the latest advancements in this area for potential future developments.
- Questions about Electronic Device Connection Technology:
1. How does this technology compare to traditional methods of connecting electronic elements to circuit substrates?
- This technology offers a more precise and efficient way of connecting bonding pads, improving overall performance and reliability.
2. What are the potential challenges in implementing this technology on a large scale in electronic manufacturing?
- Some challenges may include optimizing the manufacturing process, ensuring compatibility with existing systems, and managing production costs effectively.
Original Abstract Submitted
An electronic device includes a circuit substrate, an electronic element, and a connection layer. The circuit substrate includes a plurality of first bonding pads. The electronic element includes a plurality of second bonding pads. The connection layer is provided between one of the first bonding pads and one of the second bonding pads. The connection layer includes a first portion, a second portion, and a third portion. The second portion is a portion of the connection layer that overlaps with a projection region of the second bonding pad onto the circuit substrate. The first portion is a portion away from another first bonding pad that does not overlap with the projection region. The third portion is a portion which is adjacent to the another first bonding pad and does not overlap with the projection region. A maximum width of the first portion is different from that of the third portion.
