18430747. SEMICONDUCTOR LIGHT EMITTING DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR LIGHT EMITTING DEVICE
Organization Name
Inventor(s)
Gyeongseon Park of Suwon-si (KR)
SEMICONDUCTOR LIGHT EMITTING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18430747 titled 'SEMICONDUCTOR LIGHT EMITTING DEVICE
The semiconductor light emitting device described in the patent application consists of several key components, including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, an active layer, an electrode layer, a reflective layer, a bonding pad, an insulating layer, and an insulating spacer.
- The reflective layer is made of a material that is not etched by certain aqueous solutions, ensuring its durability and longevity.
- The bonding pad has a unique shell shape design, with a width that gradually decreases as it moves away from the reflective layer.
Potential Applications: - This technology can be used in various lighting applications, such as LED displays, signage, and general illumination. - It can also be applied in automotive lighting, medical devices, and communication systems.
Problems Solved: - The reflective layer's resistance to etching by specific solutions enhances the device's reliability and performance. - The unique design of the bonding pad improves the device's overall efficiency and functionality.
Benefits: - Increased durability and longevity of the reflective layer. - Enhanced performance and efficiency of the semiconductor light emitting device. - Versatile applications in different industries and sectors.
Commercial Applications: Title: Innovative Semiconductor Light Emitting Device for Advanced Lighting Solutions This technology can be utilized in commercial lighting fixtures, automotive headlights, electronic displays, and medical equipment, offering improved performance and durability.
Questions about Semiconductor Light Emitting Device: 1. How does the unique design of the bonding pad contribute to the overall efficiency of the device? The shell shape design of the bonding pad helps optimize the electrical connections within the device, improving its functionality and performance.
2. What are the potential market implications of implementing this innovative semiconductor light emitting device in various industries? By incorporating this technology into different applications, businesses can enhance their products with advanced lighting solutions, leading to improved performance and customer satisfaction.
Original Abstract Submitted
A semiconductor light emitting device includes a first conductivity type semiconductor layer, a second conductivity type semiconductor layer arranged on the first conductivity type semiconductor layer, an active layer, an electrode layer formed on a top surface of the second conductivity type semiconductor layer, a reflective layer formed on a part of a top surface of the electrode layer, a bonding pad formed on a top surface of the reflective layer, an insulating layer formed on another part of the top surface of the electrode layer, and an insulating spacer conformally formed along a surface of the substrate. The reflective layer includes a material that is not etched by an aqueous solution including one of tetramethyl ammonium hydroxide (TMAH), KOH, NaOH, and NHOH and the bonding pad has a shell shape including a part of which the width gradually decreases as the part distances from the reflective layer.
