18430568. INTEGRATED FAN-OUT PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

INTEGRATED FAN-OUT PACKAGE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chuei-Tang Wang of Taichung City (TW)

Tzu-Chun Tang of Kaohsiung City (TW)

Chieh-Yen Chen of Taipei City (TW)

Che-Wei Hsu of Kaohsiung City (TW)

INTEGRATED FAN-OUT PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18430568 titled 'INTEGRATED FAN-OUT PACKAGE

Simplified Explanation

An integrated fan-out (InFO) package consists of a die, an encapsulant, and a horn antenna. The die is encapsulated laterally by the encapsulant, and the horn antenna is electrically connected to the die.

• The die has an active surface and a rear surface.
• The encapsulant surrounds the die laterally.
• The horn antenna is connected to the die and includes a top wall and a bottom wall.

Key Features and Innovation

• Integration of a horn antenna into an InFO package.
• Lateral encapsulation of the die for protection.
• Electrical connection between the horn antenna and the die.

Potential Applications

The technology can be used in wireless communication devices, radar systems, and other applications requiring compact antenna solutions.

Problems Solved

• Protection of the die from external elements.
• Integration of an antenna into a compact package.

Benefits

• Compact design.
• Enhanced signal transmission.
• Improved reliability.

Commercial Applications

• Wireless communication devices.
• Radar systems.
• IoT devices.

Questions about the Technology

1. How does the lateral encapsulation of the die improve the reliability of the package? 2. What are the advantages of integrating a horn antenna into an InFO package?

Frequently Updated Research

There may be ongoing research on improving the performance and efficiency of integrated fan-out packages with horn antennas. Researchers may be exploring new materials for encapsulation and antenna design to enhance signal transmission.

Original Abstract Submitted

An integrated fan-out (InFO) package includes a die, an encapsulant, and a horn antenna. The die has an active surface and a rear surface opposite to the active surface. The encapsulant laterally encapsulates the die. The horn antenna is electrically connected to the die. The horn antenna includes a top wall and a bottom wall respectively located on two opposite sides of the die and the encapsulant.