18430414. SEMICONDUCTOR MODULE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR MODULE
Organization Name
Inventor(s)
Kohei Tanikawa of Kyoto-shi (JP)
Kenji Hayashi of Kyoto-shi (JP)
Ryosuke Fukuda of Kyoto-shi (JP)
SEMICONDUCTOR MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18430414 titled 'SEMICONDUCTOR MODULE
The semiconductor module described in the patent application consists of a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The semiconductor element is electrically bonded to the conductive substrate and has a switching function, while the control terminal is responsible for controlling the semiconductor element. The sealing resin covers the components and allows the control terminal to protrude from its surface.
- Conductive substrate with obverse and reverse surfaces
- Semiconductor element with switching function
- Control terminal for controlling the semiconductor element
- Sealing resin covering the components
- Control terminal protruding from the resin surface
Potential Applications: - Power electronics - Automotive industry - Renewable energy systems
Problems Solved: - Improved control and protection of semiconductor elements - Enhanced durability and reliability of electronic devices
Benefits: - Increased efficiency in power management - Extended lifespan of electronic components - Enhanced safety features in electronic systems
Commercial Applications: Title: "Advanced Semiconductor Module for Enhanced Power Management" This technology can be utilized in various industries such as automotive, renewable energy, and consumer electronics for improved power control and reliability.
Questions about the technology: 1. How does the control terminal enhance the functionality of the semiconductor element? 2. What are the specific advantages of using a sealing resin in this semiconductor module design?
Frequently Updated Research: Researchers are continuously exploring ways to optimize power management systems using advanced semiconductor technologies. Stay updated on the latest developments in this field for potential advancements in electronic devices.
Original Abstract Submitted
A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.
