18429926. LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Jiann-Tyng Tzeng of Hsinchu (TW)
LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18429926 titled 'LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS
Simplified Explanation
The integrated circuit described in the patent application includes a horizontal routing track in a first metal layer and a backside routing track in a backside metal layer, both connected to terminals of a transistor without passing through other metal layers.
- The integrated circuit has a horizontal routing track in a first metal layer and a backside routing track in a backside metal layer.
- The horizontal routing track is connected to a terminal of a transistor without passing through other metal layers.
- The backside routing track is connected to another terminal of the same transistor without passing through other metal layers.
- The terminals of the transistor include a gate terminal and either a source or drain terminal.
Potential Applications
This technology could be used in various electronic devices such as smartphones, computers, and other consumer electronics where space-saving and efficient routing of signals is crucial.
Problems Solved
This innovation solves the problem of routing tracks passing through multiple metal layers, reducing complexity and improving signal integrity in integrated circuits.
Benefits
The benefits of this technology include improved signal integrity, reduced complexity in routing tracks, and potentially smaller and more efficient integrated circuits.
Potential Commercial Applications
A potential commercial application of this technology could be in the semiconductor industry for manufacturing advanced integrated circuits with improved routing capabilities.
Possible Prior Art
One possible prior art could be the use of vertical routing tracks in integrated circuits to connect terminals of transistors without passing through multiple metal layers.
Unanswered Questions
How does this technology impact power consumption in integrated circuits?
This article does not address the specific impact of this technology on power consumption in integrated circuits. It would be interesting to explore whether the reduced complexity in routing tracks leads to any power savings.
What are the potential challenges in implementing this technology on a large scale?
The article does not discuss the potential challenges that may arise when implementing this technology on a large scale. It would be important to consider factors such as manufacturing costs, scalability, and compatibility with existing processes.
Original Abstract Submitted
An integrated circuit includes a horizontal routing track in a first metal layer, and a backside routing track in a backside metal layer. The backside metal layer and the first metal layer are formed at opposite sides of a semiconductor substrate. The horizontal routing track is conductively connected to a first terminal of a first transistor without passing through a routing track in another metal layer. The backside routing track is conductively connected to a second terminal of the first transistor without passing through a routing track in another metal layer. One of the first terminal and the second terminal is a gate terminal of the first transistor while another one the first terminal and the second terminal is either a source terminal or a drain terminal of the first transistor.
