18429789. CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chien-Cheng Chen of Hsinchu County (TW)
Pei-Haw Tsao of Nan-Chu, Tai-chung (TW)
CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18429789 titled 'CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE
Simplified Explanation
The chip structure described in the patent application includes a substrate, an interconnect layer, a conductive pad, a conductive bump, a support layer, and a solder structure.
- The chip structure has a conductive bump with a first portion, a second portion, and a neck portion in between, where the first portion is located between the neck portion and the conductive pad, and the neck portion is narrower than both the first and second portions.
- The support layer is positioned over the second portion of the conductive bump and has a composition different from that of the conductive bump.
- A solder structure is located over the support layer.
Potential Applications
The technology described in this patent application could be applied in the manufacturing of electronic devices, such as integrated circuits, where reliable connections between different components are essential.
Problems Solved
This technology solves the problem of ensuring secure and stable connections between components in a chip structure, which is crucial for the proper functioning of electronic devices.
Benefits
The benefits of this technology include improved reliability and performance of electronic devices, as well as potentially reducing the risk of connection failures or malfunctions.
Potential Commercial Applications
A potential commercial application of this technology could be in the semiconductor industry for the production of advanced electronic devices with enhanced connectivity and performance.
Possible Prior Art
One possible prior art for this technology could be existing methods or structures used in the semiconductor industry for creating connections between different components in electronic devices.
Unanswered Questions
How does the composition of the support layer affect the overall performance of the chip structure?
The specific impact of the support layer composition on the functionality and reliability of the chip structure is not detailed in the patent application.
What are the specific materials used in the conductive bump and support layer?
The exact materials used in the conductive bump and support layer are not specified in the patent application, leaving room for further investigation into the composition of these components.
Original Abstract Submitted
A chip structure is provided. The chip structure includes a substrate. The chip structure includes an interconnect layer over the substrate. The chip structure includes a conductive pad over the interconnect layer. The chip structure includes a conductive bump over the conductive pad. The conductive bump has a first portion, a second portion, and a neck portion between the first portion and the second portion, the first portion is between the neck portion and the conductive pad, and the neck portion is narrower than both of the first portion and the second portion. The chip structure includes a support layer over the second portion of the conductive bump. A first composition of the support layer is different from a second composition of the conductive bump. The chip structure includes a solder structure over the support layer.
