18429677. Integrated Assemblies and Methods of Forming Integrated Assemblies simplified abstract (Micron Technology, Inc.)
Contents
Integrated Assemblies and Methods of Forming Integrated Assemblies
Organization Name
Inventor(s)
Durai Vishak Nirmal Ramaswamy of Boise ID (US)
Marcello Mariani of Milano (IT)
Giorgio Servalli of Fara Gera D'Adda (IT)
Integrated Assemblies and Methods of Forming Integrated Assemblies - A simplified explanation of the abstract
This abstract first appeared for US patent application 18429677 titled 'Integrated Assemblies and Methods of Forming Integrated Assemblies
Simplified Explanation: The patent application describes an integrated assembly with two bottom electrodes separated by an insulative material, with a top electrode on top.
Key Features and Innovation:
- Integrated assembly with first and second bottom electrodes
- Intervening region between the electrodes
- Capacitor-insulative-material adjacent to the electrodes
- Top-electrode-material on top of the insulative material
Potential Applications: This technology could be used in electronic devices, sensors, and energy storage systems.
Problems Solved: This technology addresses the need for efficient and compact capacitor designs in various electronic applications.
Benefits:
- Improved capacitor performance
- Space-saving design
- Enhanced electronic device functionality
Commercial Applications: The technology could be applied in the manufacturing of smartphones, tablets, wearables, and other electronic devices, improving their performance and efficiency.
Prior Art: Readers can explore prior art related to integrated assemblies, capacitors, and electronic components in general to understand the background of this technology.
Frequently Updated Research: Stay informed about the latest developments in integrated assembly technologies, capacitor design, and electronic component innovations to enhance your understanding of this field.
Questions about Integrated Assemblies: 1. What are the key components of an integrated assembly in electronic devices? 2. How does the design of an integrated assembly impact the performance of electronic devices?
Original Abstract Submitted
Some embodiments include an integrated assembly having a first bottom electrode adjacent to a second bottom electrode. An intervening region is directly between the first and second bottom electrodes. Capacitor-insulative-material is adjacent to the first and second bottom electrodes. The capacitor-insulative-material is substantially not within the intervening region. Top-electrode-material is adjacent to the capacitor-insulative-material. Some embodiments include methods of forming integrated assemblies.
