18429039. FABRICATION METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Young-Woo Park of Cheonan-si (KR)
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18429039 titled 'FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
The method described in the abstract involves fabricating a semiconductor package by mounting at least one semiconductor chip to a package substrate, forming a shielding wall around the chip, creating a molded body on the substrate within the shielding wall, and adding a shielding cover over the molded unit in contact with the shielding wall.
- Semiconductor package fabrication method
- Mounting semiconductor chip to package substrate
- Forming shielding wall around chip
- Creating molded body within shielding wall
- Adding shielding cover over molded unit
- Shielding cover in contact with shielding wall
Potential Applications: - Semiconductor industry - Electronics manufacturing
Problems Solved: - Protecting semiconductor chips from external elements - Ensuring proper packaging for semiconductor devices
Benefits: - Enhanced protection for semiconductor chips - Improved durability of semiconductor packages
Commercial Applications: Title: Semiconductor Packaging Technology for Enhanced Protection This technology can be used in various industries such as consumer electronics, automotive, and telecommunications for the packaging of semiconductor chips.
Questions about Semiconductor Packaging Technology: 1. How does this method improve the durability of semiconductor packages?
- This method enhances the protection of semiconductor chips by adding shielding walls and covers, ensuring they are safeguarded from external factors.
2. What are the potential applications of this semiconductor packaging technology?
- This technology can be applied in the semiconductor industry and various electronic manufacturing processes to enhance the protection and durability of semiconductor chips.
Original Abstract Submitted
A method of fabricating a semiconductor package includes mounting at least one semiconductor chip to a package substrate, forming a shielding wall around the at least one semiconductor chip, forming a molded body on the package substrate in a space surrounded by the shielding wall, and forming a shielding cover covering the molding unit and in contact with the shielding wall.
