18428934. Arrangement of Power-Grounds in Package Structures simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 Arrangement of Power-Grounds in Package Structures
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Arrangement of Power-Grounds in Package Structures - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
Arrangement of Power-Grounds in Package Structures
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chun-Hua Chang of Zhubei City (TW)
Fong-Yuan Chang of Hsinchu (TW)
Jyh Chwen Frank Lee of Palo Alto CA (US)
Arrangement of Power-Grounds in Package Structures - A simplified explanation of the abstract
This abstract first appeared for US patent application 18428934 titled 'Arrangement of Power-Grounds in Package Structures
Simplified Explanation
The abstract describes a patent application for a structure with a redistribution structure that includes a power-ground macro and a metal pad in the bottom layer.
- The structure includes a redistribution structure with a bottom layer and multiple upper layers.
- The redistribution structure features a power-ground macro extending from the topmost layer to the bottommost layer.
- A metal pad in the bottom layer is overlapped by the power-ground macro but electrically disconnected from it.
Potential Applications
This technology could be applied in semiconductor manufacturing, integrated circuits, and electronic devices.
Problems Solved
This innovation helps in improving the efficiency and performance of electronic devices by providing a more efficient power distribution system.
Benefits
The benefits of this technology include enhanced power distribution, improved signal integrity, and overall better performance of electronic devices.
Potential Commercial Applications
"Enhancing Power Distribution in Electronic Devices: Applications and Benefits"
Possible Prior Art
There may be prior art related to power distribution structures in semiconductor devices and integrated circuits.
Unanswered Questions
How does this technology impact the overall cost of manufacturing electronic devices?
The article does not address the potential cost implications of implementing this technology in electronic devices.
Are there any limitations to the scalability of this technology for different types of electronic devices?
The article does not discuss any potential limitations or challenges in scaling this technology for various electronic devices.
Original Abstract Submitted
A structure includes a redistribution structure, which includes a bottom layer and a plurality of upper layers over the bottom layer. The redistribution structure also includes a power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers, and a metal pad in the bottom layer and overlapped by the power-ground macro. The metal pad is electrically disconnected from the power-ground macro.
