18428245. SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Shu-Shen Yeh of Taoyuan City (TW)
Chin-Hua Wang of New Taipei City (TW)
Po-Chen Lai of Hsinchu County (TW)
Po-Yao Lin of Hsinchu County (TW)
Shin-Puu Jeng of Po-Shan Village (TW)
SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN - A simplified explanation of the abstract
This abstract first appeared for US patent application 18428245 titled 'SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN
The semiconductor device package includes a substrate, a semiconductor device, a ring structure, a lid structure, and at least one adhesive member. The semiconductor device is placed on the substrate, with the ring structure surrounding it. The ring structure consists of a first ring part and a second ring part on opposite sides of the semiconductor device, with different gap sizes between the ring parts and the semiconductor device. The lid structure is positioned over the ring structure and extends across the semiconductor device, while the adhesive member connects the lid structure to the substrate.
- The package design includes a ring structure with different gap sizes to ensure secure placement of the semiconductor device.
- The lid structure provides additional protection and support for the semiconductor device.
- The adhesive member enhances the connection between the lid structure and the substrate.
- This design helps improve the overall reliability and performance of the semiconductor device package.
- The package design offers a practical solution for protecting and securing semiconductor devices in various applications.
Potential Applications: - Electronics industry for integrated circuits and microprocessors - Automotive industry for sensors and control units - Aerospace industry for avionics and communication systems
Problems Solved: - Ensures secure placement and protection of semiconductor devices - Enhances reliability and performance of electronic components - Provides a practical solution for various industries requiring semiconductor device packaging
Benefits: - Improved reliability and performance of semiconductor devices - Enhanced protection and security for electronic components - Versatile design suitable for various applications in different industries
Commercial Applications: Title: Advanced Semiconductor Device Packaging for Enhanced Reliability This technology can be utilized in the electronics, automotive, and aerospace industries for secure and reliable packaging of semiconductor devices, improving overall product performance and longevity.
Questions about Semiconductor Device Package: 1. How does the ring structure in the package design contribute to the overall reliability of the semiconductor device? 2. What are the key benefits of using the lid structure in semiconductor device packaging?
Original Abstract Submitted
A semiconductor device package is provided, including a substrate, a semiconductor device, a ring structure, a lid structure, and at least one adhesive member. The semiconductor device is disposed over the substrate. The ring structure is disposed over the substrate and surrounds the semiconductor device. The ring structure comprises a first ring part and a second ring part on opposite sides of the semiconductor device. A first gap is formed between the first ring part and the semiconductor device, a second gap is formed between the second ring part and the semiconductor device, and the first gap is smaller than the second gap. The lid structure is disposed over the ring structure and extends across the semiconductor device. The adhesive member is disposed in the first gap and configured to connect the lid structure and the first surface of the substrate.
