18428198. ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Sebastian Meier of Munich (DE)
Mike Mittelstaedt of Berglern (DE)
ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18428198 titled 'ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER
The abstract describes a microelectronic device with a platinum-containing layer on a substrate. The layer has two segments with different spacings and widths, providing unique properties to the device.
- The device includes a platinum-containing layer with two segments, each with different spacings and widths.
- The first segment is closer to the substrate and has a smaller width compared to the second segment.
- The spacing between the segments varies between the first and second surfaces of the layer.
- The unique design of the layer enhances the performance and functionality of the microelectronic device.
Potential Applications: - Microelectronics - Sensor technology - Semiconductor industry
Problems Solved: - Enhanced performance of microelectronic devices - Improved functionality of sensors - Increased efficiency in semiconductor manufacturing
Benefits: - Higher sensitivity and accuracy in sensors - Improved signal processing in microelectronics - Enhanced durability and reliability in semiconductor devices
Commercial Applications: - Manufacturing of advanced sensors - Development of high-performance microelectronic devices - Integration into semiconductor production processes
Questions about the technology: 1. How does the unique design of the platinum-containing layer improve the performance of the microelectronic device? 2. What potential applications can benefit the most from the enhanced properties of this device?
Frequently Updated Research: - Stay updated on the latest advancements in microelectronics and sensor technology to leverage the benefits of this innovative device.
Original Abstract Submitted
A microelectronic device includes a substrate a platinum-containing layer over the substrate. The platinum-containing layer includes a first segment and a second segment adjacent to the first segment, and has a first surface and a second surface opposite the first surface closer to the substrate than the first surface. A first spacing between the first segment and the second segment at the first surface is greater than a second spacing between the first segment and the second segment at the second surface. A width of the first segment along the first surface is less than twice a thickness of the first segment, and the second spacing is less than twice the thickness of the first segment.
