18427369. GRAPHENE AND CARBON NANOTUBE BASED THERMAL MANAGEMENT DEVICE simplified abstract (Cisco Technology, Inc.)
Contents
- 1 GRAPHENE AND CARBON NANOTUBE BASED THERMAL MANAGEMENT DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 GRAPHENE AND CARBON NANOTUBE BASED THERMAL MANAGEMENT DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
GRAPHENE AND CARBON NANOTUBE BASED THERMAL MANAGEMENT DEVICE
Organization Name
Inventor(s)
M. Baris Dogruoz of Campbell CA (US)
Mehmet Onder Cap of Sunnyvale CA (US)
D. Brice Achkir of Livermore CA (US)
Joel Richard Goergen of Soulsbyville CA (US)
GRAPHENE AND CARBON NANOTUBE BASED THERMAL MANAGEMENT DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18427369 titled 'GRAPHENE AND CARBON NANOTUBE BASED THERMAL MANAGEMENT DEVICE
Simplified Explanation
The thermal management device described in the patent application consists of a heat sink base and heat sink fins made from a single element composed of multiple graphene layers with carbon nanotubes in between.
- The device utilizes graphene layers and carbon nanotubes to enhance heat dissipation and thermal management.
- The method disclosed in the patent application involves the fabrication of a heat sink structure using advanced materials for improved thermal performance.
Potential Applications
The technology can be applied in various industries such as electronics, automotive, aerospace, and renewable energy for efficient thermal management solutions.
Problems Solved
1. Enhanced heat dissipation capabilities. 2. Improved thermal management efficiency.
Benefits
1. Increased heat transfer efficiency. 2. Reduced risk of overheating in electronic devices. 3. Extended lifespan of components due to better thermal control.
Potential Commercial Applications
Optimizing Thermal Management in Electronics: Improving heat dissipation in electronic devices for better performance and longevity.
Possible Prior Art
Prior art in the field of thermal management devices may include traditional heat sink structures made from materials like aluminum or copper.
Unanswered Questions
How does the device compare to traditional heat sink materials in terms of cost-effectiveness and performance?
The patent application does not provide a direct comparison between the new technology and traditional heat sink materials in terms of cost and performance.
What are the environmental implications of using graphene and carbon nanotubes in thermal management devices?
The potential environmental impact of using advanced materials like graphene and carbon nanotubes in thermal management devices is not addressed in the patent application.
Original Abstract Submitted
In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.
