18426153. SHIELDED RADIO-FREQUENCY DEVICES simplified abstract (SKYWORKS SOLUTIONS, INC.)
Contents
SHIELDED RADIO-FREQUENCY DEVICES
Organization Name
Inventor(s)
Pietro Natale Alessandro Chyurlia of Ottawa (CA)
SHIELDED RADIO-FREQUENCY DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18426153 titled 'SHIELDED RADIO-FREQUENCY DEVICES
The abstract describes a shielded assembly consisting of a substrate, a flip chip die with an integrated circuit on the front side, and a shielding component on the back side of the flip chip die for electromagnetic shielding.
- The shielded assembly includes a substrate and a flip chip die with an integrated circuit.
- The flip chip die is mounted on the substrate with the front side facing up.
- A shielding component is implemented over the back side of the flip chip die to provide electromagnetic shielding.
- The shielding component separates a first region within or on the flip chip die from a second region away from the die.
- This design helps prevent electromagnetic interference and ensures proper functioning of the integrated circuit.
Potential Applications: - Electronic devices requiring electromagnetic shielding. - High-frequency communication systems. - Aerospace and defense technology.
Problems Solved: - Electromagnetic interference affecting integrated circuits. - Ensuring reliable performance of electronic devices in various environments.
Benefits: - Improved reliability of electronic devices. - Enhanced performance of integrated circuits. - Protection against electromagnetic interference.
Commercial Applications: Title: "Electromagnetic Shielded Assemblies for Enhanced Device Performance" This technology can be used in the manufacturing of electronic devices, communication systems, and aerospace equipment to ensure reliable performance in challenging electromagnetic environments.
Questions about Shielded Assemblies: 1. How does the shielding component in the assembly provide electromagnetic protection? The shielding component on the back side of the flip chip die acts as a barrier between different regions to prevent electromagnetic interference. 2. What are the potential commercial applications of shielded assemblies? Shielded assemblies can be used in various industries such as electronics, communications, and aerospace for reliable performance in electromagnetic environments.
Original Abstract Submitted
In some embodiments, a shielded assembly can include a substrate and a flip chip die having a front side and a back side, with the including an integrated circuit implemented on the front side, and the front side of the flip chip die being mounted to the substrate. The shielded assembly can further include a shielding component implemented over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.
