18423636. Dynamic Phased Array Plasma Source For Complete Plasma Coverage Of A Moving Substrate simplified abstract (Applied Materials, Inc.)
Contents
- 1 Dynamic Phased Array Plasma Source For Complete Plasma Coverage Of A Moving Substrate
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Dynamic Phased Array Plasma Source For Complete Plasma Coverage Of A Moving Substrate - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
Dynamic Phased Array Plasma Source For Complete Plasma Coverage Of A Moving Substrate
Organization Name
Inventor(s)
Hari Ponnekanti of San Jose CA (US)
Mukund Srinivasan of Fremont CA (US)
Dynamic Phased Array Plasma Source For Complete Plasma Coverage Of A Moving Substrate - A simplified explanation of the abstract
This abstract first appeared for US patent application 18423636 titled 'Dynamic Phased Array Plasma Source For Complete Plasma Coverage Of A Moving Substrate
Simplified Explanation
The patent application describes an apparatus and methods for processing a substrate using a gas distribution assembly with an array of individual plasma sources. A controller is connected to the array of plasma sources and the substrate support to monitor the position of the substrate and provide or disable power to the individual plasma sources based on the substrate's position.
- Gas distribution assembly with array of individual plasma sources
- Controller connected to plasma sources and substrate support
- Controller monitors substrate position and controls power to plasma sources accordingly
Potential Applications
This technology could be applied in industries such as semiconductor manufacturing, solar panel production, and display manufacturing where precise control of plasma processes is required.
Problems Solved
1. Improved control over plasma processes 2. Enhanced uniformity and efficiency in substrate processing
Benefits
1. Increased productivity and yield in manufacturing processes 2. Reduced energy consumption and waste 3. Enhanced quality and consistency of processed substrates
Potential Commercial Applications
Optimizing Plasma Processing for Substrate Manufacturing
Possible Prior Art
Prior art may include similar systems for controlling plasma processes in substrate manufacturing, but the specific configuration and control mechanism described in this patent application may be novel.
Unanswered Questions
How does the controller determine the position of the substrate?
The abstract does not provide details on the specific technology or sensors used by the controller to monitor the substrate's position.
What types of substrates can be processed using this apparatus?
The abstract does not specify the range of substrates that can be processed using this technology, leaving room for exploration of its versatility.
Original Abstract Submitted
Apparatus and methods to process a substrate comprising a gas distribution assembly comprising a plasma process region with an array of individual plasma sources. A controller is connected to the array of individual plasma sources and the substrate support. The controller is configured monitor the position of the at least one substrate and provide or disable power to the individual plasma sources based on the position of the substrate relative to the individual plasma sources.
