18422847. Liquid Cooling Plate, Liquid Cooling System, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
Contents
- 1 Liquid Cooling Plate, Liquid Cooling System, and Electronic Device
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Liquid Cooling Plate, Liquid Cooling System, and Electronic Device - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
Liquid Cooling Plate, Liquid Cooling System, and Electronic Device
Organization Name
Inventor(s)
Jianliang Wang of Dongguan (CN)
Liquid Cooling Plate, Liquid Cooling System, and Electronic Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 18422847 titled 'Liquid Cooling Plate, Liquid Cooling System, and Electronic Device
Simplified Explanation
The liquid cooling plate described in the patent application includes a housing with an accommodation cavity, a support structure in the cavity, and a coolant that flows through the cavity to dissipate heat from a heat generating device. The housing has a top wall and a bottom wall, forming the accommodation cavity with a first and second region. The support structure is located in the first region between the top and bottom walls, while the second region can deform to absorb volume variations of the coolant.
- Housing with accommodation cavity
- Support structure in the first region
- Coolant flowing through the cavity
- Deformable second region to absorb volume variations
Potential Applications
The technology could be used in various cooling systems for electronic devices, such as computers, servers, and power electronics.
Problems Solved
1. Efficient heat dissipation from heat generating devices. 2. Managing volume variations of the coolant.
Benefits
1. Improved cooling efficiency. 2. Compact design. 3. Enhanced performance and longevity of electronic devices.
Potential Commercial Applications
"Advanced Liquid Cooling Plate Technology for Electronic Devices"
Possible Prior Art
There are existing liquid cooling systems for electronic devices, but the specific design of a housing with accommodation cavity, support structure, and deformable region to absorb volume variations may be unique to this patent application.
Unanswered Questions
How does the support structure enhance heat dissipation compared to traditional cooling systems?
The support structure may provide better contact between the coolant and the heat generating device, improving heat transfer efficiency.
What materials are used in the construction of the housing to withstand the temperature variations of the coolant?
The housing may be made of materials such as aluminum or copper alloys known for their thermal conductivity and durability.
Original Abstract Submitted
A liquid cooling plate includes a housing, a support structure, and a coolant. The housing includes a top wall and a bottom wall, the top wall and the bottom wall are covered to form an accommodation cavity, and the accommodation cavity includes a first region and a second region. The support structure is disposed in the first region and is located between the top wall and the bottom wall. The coolant flows in the accommodation cavity to dissipate heat from a heat generating device, the coolant can expand in volume when being heated and shrink in volume when being cooled, and the second region can deform to absorb a volume variation of the coolant.
