18422778. SEMICONDUCTOR PACKAGE HAVING CHIP STACK simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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SEMICONDUCTOR PACKAGE HAVING CHIP STACK
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SEMICONDUCTOR PACKAGE HAVING CHIP STACK - A simplified explanation of the abstract
This abstract first appeared for US patent application 18422778 titled 'SEMICONDUCTOR PACKAGE HAVING CHIP STACK
The semiconductor package described in the patent application consists of a substrate, a master chip mounted on the substrate, a first slave chip placed on top of the master chip, partially exposing the master chip's surface, and a first chip connector connecting the master chip and the first slave chip.
- The first slave chip is the same size as the master chip and has an equal storage capacity.
- The first chip connector is located on the exposed surface of the master chip, facilitating communication between the master chip and the first slave chip.
Potential Applications: - This technology could be used in various electronic devices requiring high storage capacity in a compact form factor. - It may find applications in mobile phones, tablets, and other portable electronic devices.
Problems Solved: - Enables increased storage capacity in a limited space. - Facilitates efficient communication between chips in a semiconductor package.
Benefits: - Compact design with high storage capacity. - Improved performance and communication between chips.
Commercial Applications: Title: Semiconductor Package with Enhanced Storage Capacity This technology could be valuable in the consumer electronics industry, particularly in the development of smartphones, tablets, and other portable devices where space is limited, but high storage capacity is essential. The market implications include potential cost savings due to the efficient use of space and improved device performance.
Prior Art: No prior art information is available at this time.
Frequently Updated Research: There is ongoing research in the semiconductor industry to enhance storage capacity and communication efficiency within semiconductor packages. Stay updated on the latest advancements in this field for potential future applications.
Questions about Semiconductor Package with Enhanced Storage Capacity:
Question 1: How does this technology compare to traditional semiconductor packaging methods? Answer: This technology offers a more compact design with increased storage capacity compared to traditional methods, making it ideal for space-constrained electronic devices.
Question 2: What are the potential challenges in implementing this semiconductor package in mass-produced electronic devices? Answer: Some challenges may include ensuring compatibility with existing device designs, optimizing manufacturing processes for mass production, and addressing any potential reliability issues that may arise.
Original Abstract Submitted
A semiconductor package includes a substrate, a master chip on the substrate, a first slave chip on a top surface of the master chip and partially exposing the top surface of the master chip, the first slave chip having a same size as the master chip and having a same storage capacity as the master chip, and a first chip connector on the exposed top surface of the master chip and coupled to the master chip and the first slave chip.
