18421051. SUBSTRATE PROCESSING APPARATUS, TRANSFER METHOD OF SUBSTRATE SUPPORT, RECORDING MEDIUM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (Kokusai Electric Corporation)
SUBSTRATE PROCESSING APPARATUS, TRANSFER METHOD OF SUBSTRATE SUPPORT, RECORDING MEDIUM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Yukinori Aburatani of Toyama-shi (JP)
Naofumi Ohashi of Toyama-shi (JP)
SUBSTRATE PROCESSING APPARATUS, TRANSFER METHOD OF SUBSTRATE SUPPORT, RECORDING MEDIUM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18421051 titled 'SUBSTRATE PROCESSING APPARATUS, TRANSFER METHOD OF SUBSTRATE SUPPORT, RECORDING MEDIUM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
The abstract describes a technique involving a process chamber, substrate supports, a rotatable table, and a heat conduction insulator to suppress heat conduction between the supports.
- Process chamber for substrate processing
- Plurality of substrate supports for supporting the substrate
- Rotatable table with supports for the substrate supports
- Heat conduction insulator to suppress heat conduction between supports
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar panel production
Problems Solved: - Minimizing heat transfer between supports - Ensuring uniform substrate processing
Benefits: - Improved process efficiency - Enhanced substrate quality - Reduced energy consumption
Commercial Applications: Title: "Advanced Substrate Processing System for Semiconductor Manufacturing" This technology can be used in semiconductor fabrication facilities to enhance production efficiency and product quality.
Questions about the technology: 1. How does the heat conduction insulator work to suppress heat transfer between the supports? 2. What are the specific advantages of using a rotatable table with supports for substrate processing?
Original Abstract Submitted
There is provided a technique that includes a process chamber in which a substrate is processed; a plurality of substrate supports configured to support the substrate; a rotatable table including a plurality of supports configured to support the plurality of substrate supports; and a heat conduction insulator configured to suppress heat conduction between the plurality of supports.
