18420282. SEMICONDUCTOR MODULE simplified abstract (FUJI ELECTRIC CO., LTD.)
Contents
SEMICONDUCTOR MODULE
Organization Name
Inventor(s)
Akio Yamano of Frankfurt am Main (DE)
SEMICONDUCTOR MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18420282 titled 'SEMICONDUCTOR MODULE
The semiconductor module described in the abstract consists of two semiconductor chips, each with control electrodes and main electrodes, as well as a plate-shaped wiring member that connects the main electrodes of the two chips.
- The first semiconductor chip has a first top surface with a first control electrode and a first main electrode, while the second semiconductor chip has a second top surface with a second control electrode and a second main electrode.
- The first semiconductor chip is spaced apart from the second semiconductor chip in a first direction, with the first control electrode positioned between the first-peripheral edge and the first main electrode.
- The second semiconductor chip is positioned in the opposite direction, with the second control electrode between the second-peripheral edge and the second main electrode.
Potential Applications: - This technology can be used in various electronic devices where precise control of semiconductor components is required. - It can be applied in power electronics, telecommunications, and computing systems to enhance performance and efficiency.
Problems Solved: - This technology addresses the need for compact and efficient semiconductor modules with improved control and connectivity between chips. - It solves the challenge of maintaining proper electrical connections between multiple semiconductor components in a limited space.
Benefits: - Improved performance and reliability of electronic devices. - Enhanced control and connectivity between semiconductor chips. - Space-saving design for compact electronic systems.
Commercial Applications: Title: Advanced Semiconductor Module for Enhanced Electronic Control This technology can be commercialized in the semiconductor industry for the development of high-performance electronic devices with improved control and connectivity. It can cater to a wide range of applications in various sectors, including consumer electronics, automotive, and industrial automation.
Questions about the technology: 1. How does the spacing between the semiconductor chips impact the overall performance of the module? 2. What are the specific advantages of having control electrodes positioned between the peripheral edges and main electrodes in each semiconductor chip?
Original Abstract Submitted
A semiconductor module includes a first semiconductor chip having a first top surface on which a first control electrode and a first main electrode are disposed, a second semiconductor chip having a second top surface on which a second control electrode and a second main electrode are disposed, and a plate-shaped wiring member facing, and being electrically connected to, the first and second main electrodes, in which the first semiconductor chip is spaced apart from the second semiconductor chip in a first direction in plan view, the first top surface has a first-peripheral edge in the first direction, the first control electrode is interposed between the first-peripheral edge and the first main electrode, the second top surface has a second-peripheral edge in a second direction opposite to the first direction, and the second control electrode is interposed between the second-peripheral edge and the second main electrode.
